| DS1225Y-150+ | SRAM | The DS1225Y-150+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 64Kb (8K x 8) memory size, 4.5V ~ 5.5V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-DIP Module (0.600", 15.24mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1225Y-150+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-DIP Module (0.600", 15.24mm) | RFQ for sourcing | $32.10 | OBSOLETE | RFQ |
| DS1225Y-150IND+ | SRAM | The DS1225Y-150IND+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 64Kb (8K x 8) memory size, 4.5V ~ 5.5V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-DIP Module (0.600", 15.24mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1225Y-150IND+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-DIP Module (0.600", 15.24mm) | RFQ for sourcing | $6.49 | OBSOLETE | RFQ |
| DS1225Y-200IND+ | SRAM | The DS1225Y-200IND+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 64Kb (8K x 8) memory size, 4.5V ~ 5.5V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-DIP Module (0.600", 15.24mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1225Y-200IND+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-DIP Module (0.600", 15.24mm) | RFQ for sourcing | $11.23 | OBSOLETE | RFQ |
| DS1230AB-100+ | SRAM | The DS1230AB-100+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 256Kb (32K x 8) memory size, 4.75V ~ 5.25V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-DIP Module (0.600", 15.24mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1230AB-100+ is currently in active production through Maxim Integrated's standard distribution channels. | 28-DIP Module (0.600", 15.24mm) | 6.279 In Stock | $32.69 | ACTIVE | RFQ |
| DS1230AB-120 | SRAM | The DS1230AB-120 is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 256Kb (32K x 8) memory size, 4.75V ~ 5.25V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-DIP Module (0.600", 15.24mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1230AB-120 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-DIP Module (0.600", 15.24mm) | RFQ for sourcing | $17.90 | OBSOLETE | RFQ |
| DS1230AB-120+ | SRAM | The DS1230AB-120+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 256Kb (32K x 8) memory size, 4.75V ~ 5.25V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-DIP Module (0.600", 15.24mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1230AB-120+ is currently in active production through Maxim Integrated's standard distribution channels. | 28-DIP Module (0.600", 15.24mm) | 1.579 In Stock | $34.45 | ACTIVE | RFQ |
| DS1230AB-120IND | SRAM | The DS1230AB-120IND is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 256Kb (32K x 8) memory size, 4.75V ~ 5.25V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-DIP Module (0.600", 15.24mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1230AB-120IND is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-DIP Module (0.600", 15.24mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| DS1230AB-120IND+ | SRAM | The DS1230AB-120IND+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 256Kb (32K x 8) memory size, 4.75V ~ 5.25V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-DIP Module (0.600", 15.24mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1230AB-120IND+ is currently in active production through Maxim Integrated's standard distribution channels. | 28-DIP Module (0.600", 15.24mm) | 1.580 In Stock | $33.73 | ACTIVE | RFQ |
| DS1230AB-150+ | SRAM | The DS1230AB-150+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 256Kb (32K x 8) memory size, 4.75V ~ 5.25V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-DIP Module (0.600", 15.24mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1230AB-150+ is currently in active production through Maxim Integrated's standard distribution channels. | 28-DIP Module (0.600", 15.24mm) | 1.647 In Stock | $33.22 | ACTIVE | RFQ |
| DS1230AB-200+ | SRAM | The DS1230AB-200+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 256Kb (32K x 8) memory size, 4.75V ~ 5.25V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-DIP Module (0.600", 15.24mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1230AB-200+ is currently in active production through Maxim Integrated's standard distribution channels. | 28-DIP Module (0.600", 15.24mm) | 1.729 In Stock | $33.48 | ACTIVE | RFQ |
| DS1230AB-70 | SRAM | The DS1230AB-70 is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 256Kb (32K x 8) memory size, 4.75V ~ 5.25V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-DIP Module (0.600", 15.24mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1230AB-70 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-DIP Module (0.600", 15.24mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| DS1230AB-70+ | SRAM | The DS1230AB-70+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 256Kb (32K x 8) memory size, 4.75V ~ 5.25V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-DIP Module (0.600", 15.24mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1230AB-70+ is currently in active production through Maxim Integrated's standard distribution channels. | 28-DIP Module (0.600", 15.24mm) | 3.438 In Stock | $10.96 | ACTIVE | RFQ |
| DS1230AB-70IND+ | SRAM | The DS1230AB-70IND+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 256Kb (32K x 8) memory size, 4.75V ~ 5.25V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-DIP Module (0.600", 15.24mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1230AB-70IND+ is currently in active production through Maxim Integrated's standard distribution channels. | 28-DIP Module (0.600", 15.24mm) | 1.528 In Stock | $6.15 | ACTIVE | RFQ |
| DS1230ABP-70 | SRAM | The DS1230ABP-70 is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 256Kb (32K x 8) memory size, 4.75V ~ 5.25V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 34-PowerCap™ Module package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1230ABP-70 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 34-PowerCap™ Module | RFQ for sourcing | $24.04 | OBSOLETE | RFQ |
| DS1230ABP-70+ | SRAM | The DS1230ABP-70+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 256Kb (32K x 8) memory size, 4.75V ~ 5.25V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 34-PowerCap™ Module package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1230ABP-70+ is currently in active production through Maxim Integrated's standard distribution channels. | 34-PowerCap™ Module | 1.913 In Stock | $39.33 | ACTIVE | RFQ |
| DS1230ABP-70IND | SRAM | The DS1230ABP-70IND is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 256Kb (32K x 8) memory size, 4.75V ~ 5.25V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 34-PowerCap™ Module package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1230ABP-70IND is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 34-PowerCap™ Module | RFQ for sourcing | $151.31 | OBSOLETE | RFQ |
| DS1230W-100 | SRAM | The DS1230W-100 is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 256Kb (32K x 8) memory size, 3V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-DIP Module (0.600", 15.24mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1230W-100 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-DIP Module (0.600", 15.24mm) | RFQ for sourcing | $2.82 | OBSOLETE | RFQ |
| DS1230W-100+ | SRAM | The DS1230W-100+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 256Kb (32K x 8) memory size, 3V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-DIP Module (0.600", 15.24mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1230W-100+ is currently in active production through Maxim Integrated's standard distribution channels. | 28-DIP Module (0.600", 15.24mm) | 1.602 In Stock | $31.93 | ACTIVE | RFQ |
| DS1230W-100IND | SRAM | The DS1230W-100IND is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 256Kb (32K x 8) memory size, 3V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-DIP Module (0.600", 15.24mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1230W-100IND is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-DIP Module (0.600", 15.24mm) | RFQ for sourcing | $17.90 | OBSOLETE | RFQ |
| DS1230W-100IND+ | SRAM | The DS1230W-100IND+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 256Kb (32K x 8) memory size, 3V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 28-DIP Module (0.600", 15.24mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1230W-100IND+ is currently in active production through Maxim Integrated's standard distribution channels. | 28-DIP Module (0.600", 15.24mm) | 3.252 In Stock | $36.66 | ACTIVE | RFQ |