| DS1258Y-70 | SRAM | The DS1258Y-70 is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 2Mb (128K x 16) memory size, 4.5V ~ 5.5V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 40-DIP Module (0.610", 15.495mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1258Y-70 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 40-DIP Module (0.610", 15.495mm) | RFQ for sourcing | $98.39 | OBSOLETE | RFQ |
| DS1258Y-70# | SRAM | The DS1258Y-70# is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 2Mb (128K x 16) memory size, 4.5V ~ 5.5V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 40-DIP Module (0.610", 15.495mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1258Y-70# is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 40-DIP Module (0.610", 15.495mm) | RFQ for sourcing | $98.39 | OBSOLETE | RFQ |
| DS1258Y-70IND# | SRAM | The DS1258Y-70IND# is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 2Mb (128K x 16) memory size, 4.5V ~ 5.5V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 40-DIP Module (0.610", 15.495mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1258Y-70IND# is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 40-DIP Module (0.610", 15.495mm) | RFQ for sourcing | $5.16 | OBSOLETE | RFQ |
| DS1259S+T&R | Battery Management ICs | The DS1259S+T&R is a battery management IC manufactured by Maxim Integrated. Technical highlights include 0°C ~ 70°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across 0°C ~ 70°C (TA). Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS1259S+T&R is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $21.72 | OBSOLETE | RFQ |
| DS1259SN+ | Battery Management ICs | The DS1259SN+ is a battery management IC manufactured by Maxim Integrated. Technical highlights include 0°C ~ 70°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across 0°C ~ 70°C (TA). Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS1259SN+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| DS1259SN+T&R | Battery Management ICs | The DS1259SN+T&R is a battery management IC manufactured by Maxim Integrated. Technical highlights include 0°C ~ 70°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across 0°C ~ 70°C (TA). Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS1259SN+T&R is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $24.95 | OBSOLETE | RFQ |
| DS1259SN/T&R | Battery Management ICs | The DS1259SN/T&R is a battery management IC manufactured by Maxim Integrated. Technical highlights include 0°C ~ 70°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across 0°C ~ 70°C (TA). Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS1259SN/T&R is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $24.95 | OBSOLETE | RFQ |
| DS1260-50 | General Memory ICs | The DS1260-50 is a memory IC manufactured by Maxim Integrated. Design review should confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, supply voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 16-DIP Module (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1260-50 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-DIP Module (0.300", 7.62mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| DS1265AB-100+ | SRAM | The DS1265AB-100+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 8Mb (1M x 8) memory size, 4.75V ~ 5.25V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 36-DIP Module (0.610", 15.49mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1265AB-100+ is currently in active production through Maxim Integrated's standard distribution channels. | 36-DIP Module (0.610", 15.49mm) | 1.563 In Stock | $84.47 | ACTIVE | RFQ |
| DS1265AB-70+ | SRAM | The DS1265AB-70+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 8Mb (1M x 8) memory size, 4.75V ~ 5.25V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 36-DIP Module (0.610", 15.49mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1265AB-70+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 36-DIP Module (0.610", 15.49mm) | RFQ for sourcing | $101.30 | OBSOLETE | RFQ |
| DS1265AB-70IND | SRAM | The DS1265AB-70IND is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 8Mb (1M x 8) memory size, 4.75V ~ 5.25V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 36-DIP Module (0.610", 15.49mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1265AB-70IND is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 36-DIP Module (0.610", 15.49mm) | RFQ for sourcing | $3.09 | OBSOLETE | RFQ |
| DS1265AB-70IND+ | SRAM | The DS1265AB-70IND+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 8Mb (1M x 8) memory size, 4.75V ~ 5.25V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 36-DIP Module (0.610", 15.49mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1265AB-70IND+ is currently in active production through Maxim Integrated's standard distribution channels. | 36-DIP Module (0.610", 15.49mm) | 1.810 In Stock | $123.25 | ACTIVE | RFQ |
| DS1265W-100 | SRAM | The DS1265W-100 is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 8Mb (1M x 8) memory size, 3V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 36-DIP Module (0.610", 15.49mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1265W-100 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 36-DIP Module (0.610", 15.49mm) | RFQ for sourcing | $2.30 | OBSOLETE | RFQ |
| DS1265W-100+ | SRAM | The DS1265W-100+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 8Mb (1M x 8) memory size, 3V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 36-DIP Module (0.610", 15.49mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1265W-100+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 36-DIP Module (0.610", 15.49mm) | RFQ for sourcing | $13.74 | OBSOLETE | RFQ |
| DS1265W-100IND | SRAM | The DS1265W-100IND is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 8Mb (1M x 8) memory size, 3V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 36-DIP Module (0.610", 15.49mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1265W-100IND is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 36-DIP Module (0.610", 15.49mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| DS1265W-100IND+ | SRAM | The DS1265W-100IND+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 8Mb (1M x 8) memory size, 3V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 36-DIP Module (0.610", 15.49mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1265W-100IND+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 36-DIP Module (0.610", 15.49mm) | RFQ for sourcing | $345.30 | OBSOLETE | RFQ |
| DS1265W-150+ | SRAM | The DS1265W-150+ is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 8Mb (1M x 8) memory size, 3V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 36-DIP Module (0.610", 15.49mm) package and is rated for operation across 0°C ~ 70°C. Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1265W-150+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 36-DIP Module (0.610", 15.49mm) | RFQ for sourcing | $90.07 | OBSOLETE | RFQ |
| DS1265Y-100 | SRAM | The DS1265Y-100 is an SRAM memory device manufactured by Maxim Integrated. Key technical specifications include 8Mb (1M x 8) memory size, 4.5V ~ 5.5V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 36-DIP Module (0.610", 15.49mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the DS1265Y-100 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 36-DIP Module (0.610", 15.49mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| DS1267-010 | Digital Potentiometers | The DS1267-010 is a digital potentiometer manufactured by Maxim Integrated. Technical highlights include 5V supply voltage and ±20% accuracy; design review should confirm ADC or DAC signal-chain requirements, channel count, resolution, supply voltage, and operating temperature limits. This Through Hole component is supplied in a 14-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for instrumentation, medical devices, and audio systems applications, the DS1267-010 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 14-DIP (0.300", 7.62mm) | RFQ for sourcing | $14.13 | OBSOLETE | RFQ |
| DS1267-010+ | Digital Potentiometers | The DS1267-010+ is a digital potentiometer manufactured by Maxim Integrated. Technical highlights include 5V supply voltage and ±20% accuracy; design review should confirm ADC or DAC signal-chain requirements, channel count, resolution, supply voltage, and operating temperature limits. This Through Hole component is supplied in a 14-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for instrumentation, medical devices, and audio systems applications, the DS1267-010+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 14-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |