| AX500-FG676I | FPGAs | The AX500-FG676I is an FPGA manufactured by Microsemi. Key technical specifications include 500000 gates, 8064 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AX500-FG676I is currently in active production through Microsemi's standard distribution channels. | 676-BGA | 58.900 In Stock | $174.82 | ACTIVE | RFQ |
| AX500-FG676M | FPGAs | The AX500-FG676M is an FPGA manufactured by Microsemi. Key technical specifications include 500000 gates, 8064 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -55°C ~ 125°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BGA package and is rated for operation across -55°C ~ 125°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AX500-FG676M is currently in active production through Microsemi's standard distribution channels. | 676-BGA | 45.517 In Stock | $874.08 | ACTIVE | RFQ |
| AX500-FGG484 | FPGAs | The AX500-FGG484 is an FPGA manufactured by Microsemi. Key technical specifications include 500000 gates, 8064 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BGA package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AX500-FGG484 is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 1.520 In Stock | $337.17 | ACTIVE | RFQ |
| AX500-FGG484I | FPGAs | The AX500-FGG484I is an FPGA manufactured by Microsemi. Key technical specifications include 500000 gates, 8064 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AX500-FGG484I is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 2.965 In Stock | RFQ | ACTIVE | RFQ |
| AX500-FGG484M | FPGAs | The AX500-FGG484M is an FPGA manufactured by Microsemi. Key technical specifications include 500000 gates, 8064 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -55°C ~ 125°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BGA package and is rated for operation across -55°C ~ 125°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AX500-FGG484M is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 9.501 In Stock | $51.96 | ACTIVE | RFQ |
| AX500-FGG676 | FPGAs | The AX500-FGG676 is an FPGA manufactured by Microsemi. Key technical specifications include 500000 gates, 8064 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BGA package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AX500-FGG676 is currently in active production through Microsemi's standard distribution channels. | 676-BGA | 2.349 In Stock | RFQ | ACTIVE | RFQ |
| AX500-FGG676I | FPGAs | The AX500-FGG676I is an FPGA manufactured by Microsemi. Key technical specifications include 500000 gates, 8064 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AX500-FGG676I is currently in active production through Microsemi's standard distribution channels. | 676-BGA | 14.961 In Stock | $54.18 | ACTIVE | RFQ |
| AX500-FGG676M | FPGAs | The AX500-FGG676M is an FPGA manufactured by Microsemi. Key technical specifications include 500000 gates, 8064 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -55°C ~ 125°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BGA package and is rated for operation across -55°C ~ 125°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AX500-FGG676M is currently in active production through Microsemi's standard distribution channels. | 676-BGA | 9.719 In Stock | $36.17 | ACTIVE | RFQ |
| AX500-PQ208 | FPGAs | The AX500-PQ208 is an FPGA manufactured by Microsemi. Key technical specifications include 500000 gates, 8064 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AX500-PQ208 is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 208-BFQFP | RFQ for sourcing | $89.99 | OBSOLETE | RFQ |
| AX500-PQ208M | FPGAs | The AX500-PQ208M is an FPGA manufactured by Microsemi. Key technical specifications include 500000 gates, 8064 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -55°C ~ 125°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across -55°C ~ 125°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AX500-PQ208M is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 208-BFQFP | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| AX500-PQG208 | FPGAs | The AX500-PQG208 is an FPGA manufactured by Microsemi. Key technical specifications include 500000 gates, 8064 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AX500-PQG208 is currently in active production through Microsemi's standard distribution channels. | 208-BFQFP | 2.386 In Stock | RFQ | ACTIVE | RFQ |
| AX500-PQG208I | FPGAs | The AX500-PQG208I is an FPGA manufactured by Microsemi. Key technical specifications include 500000 gates, 8064 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AX500-PQG208I is currently in active production through Microsemi's standard distribution channels. | 208-BFQFP | 604 In Stock | RFQ | ACTIVE | RFQ |
| AX500-PQG208M | FPGAs | The AX500-PQG208M is an FPGA manufactured by Microsemi. Key technical specifications include 500000 gates, 8064 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -55°C ~ 125°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across -55°C ~ 125°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AX500-PQG208M is currently in active production through Microsemi's standard distribution channels. | 208-BFQFP | 1.521 In Stock | $1633.99 | ACTIVE | RFQ |
| LX1673-09CPW | Linear & Switching Controllers | The LX1673-09CPW is a switch IC manufactured by Microsemi. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm switching current, MOSFET behavior, input voltage, package fit, and operating temperature limits. This Surface Mount component is supplied in a 20-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for battery-powered devices, portable electronics, and industrial sensors applications, the LX1673-09CPW is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-TSSOP (0.173", 4.40mm Width) | RFQ for sourcing | $38.29 | OBSOLETE | RFQ |
| M1A3P600L-FG256I | FPGAs | The M1A3P600L-FG256I is an FPGA manufactured by Microsemi, part of the ProASIC3L series. Technical highlights include -40°C ~ 100°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 256-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the M1A3P600L-FG256I is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-LBGA | RFQ for sourcing | $166.50 | OBSOLETE | RFQ |
| M1AGL600V2-FG484I | FPGAs | The M1AGL600V2-FG484I is an FPGA manufactured by Microsemi, part of the IGLOO series. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 484-BGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the M1AGL600V2-FG484I is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 484-BGA | RFQ for sourcing | $181.13 | OBSOLETE | RFQ |
| M1AGL600V5-FG484I | FPGAs | The M1AGL600V5-FG484I is an FPGA manufactured by Microsemi, part of the IGLOO series. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 484-BGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the M1AGL600V5-FG484I is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 484-BGA | RFQ for sourcing | $165.03 | OBSOLETE | RFQ |
| M1AGL600V5-FGG484 | FPGAs | The M1AGL600V5-FGG484 is an FPGA manufactured by Microsemi, part of the IGLOO series. Technical highlights include 0°C ~ 70°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 484-BGA package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the M1AGL600V5-FGG484 is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 484-BGA | RFQ for sourcing | $143.50 | OBSOLETE | RFQ |
| M2GL005-1FG484 | FPGAs | The M2GL005-1FG484 is an FPGA manufactured by Microsemi. Key technical specifications include 6060 logic elements, 1.14V ~ 2.625V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the M2GL005-1FG484 is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 1.355 In Stock | $62.72 | ACTIVE | RFQ |
| M2GL005-1FG484I | FPGAs | The M2GL005-1FG484I is an FPGA manufactured by Microsemi, part of the IGLOO2 series. Technical highlights include -40°C ~ 100°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 484-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the M2GL005-1FG484I is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 2.997 In Stock | $47.28 | ACTIVE | RFQ |