| DS3150QC1+ | Telecom ICs | The DS3150QC1+ is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 28-LCC (J-Lead) package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3150QC1+ is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-LCC (J-Lead) | RFQ for sourcing | $25.38 | OBSOLETE | RFQ |
| DS3150QNC1+ | Telecom ICs | The DS3150QNC1+ is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3150QNC1+ is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | $28.03 | OBSOLETE | RFQ |
| DS3150TN1 | Telecom ICs | The DS3150TN1 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3150TN1 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | $27.39 | OBSOLETE | RFQ |
| DS3150TNC1 | Telecom ICs | The DS3150TNC1 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3150TNC1 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | $43.20 | OBSOLETE | RFQ |
| DS3151 | Telecom ICs | The DS3151 is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3151 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $91.31 | OBSOLETE | RFQ |
| DS3151NB1 | Telecom ICs | The DS3151NB1 is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3151NB1 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $29.45 | OBSOLETE | RFQ |
| DS3152+ | Telecom ICs | The DS3152+ is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3152+ is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $54.80 | OBSOLETE | RFQ |
| DS3152B1 | Telecom ICs | The DS3152B1 is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3152B1 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $54.80 | OBSOLETE | RFQ |
| DS3152N | Telecom ICs | The DS3152N is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3152N is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $63.00 | OBSOLETE | RFQ |
| DS3152N+ | Telecom ICs | The DS3152N+ is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3152N+ is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $59.53 | OBSOLETE | RFQ |
| DS3153 | Telecom ICs | The DS3153 is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3153 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $74.78 | OBSOLETE | RFQ |
| DS3153N | Telecom ICs | The DS3153N is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3153N is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $492.38 | OBSOLETE | RFQ |
| DS3154 | Telecom ICs | The DS3154 is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3154 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $95.87 | OBSOLETE | RFQ |
| DS3154+ | Telecom ICs | The DS3154+ is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3154+ is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $1001.88 | OBSOLETE | RFQ |
| DS3154NCA2 | Telecom ICs | The DS3154NCA2 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3154NCA2 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | $103.50 | OBSOLETE | RFQ |
| DS3162 | Telecom ICs | The DS3162 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3162 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | $208.84 | OBSOLETE | RFQ |
| DS3163 | Specialized ICs | The DS3163 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 400-BBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3163 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 400-BBGA | RFQ for sourcing | $124.12 | OBSOLETE | RFQ |
| DS3164 | Specialized ICs | The DS3164 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 400-BBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3164 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 400-BBGA | RFQ for sourcing | $188.45 | OBSOLETE | RFQ |
| DS3170N | Telecom ICs | The DS3170N is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and DS3, E3 interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 100-LBGA, CSBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3170N is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 100-LBGA, CSBGA | RFQ for sourcing | $751.93 | OBSOLETE | RFQ |
| DS3172 | Drivers, Receivers & Transceivers | The DS3172 is a transceiver IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for motor control, LED lighting, and display backlight applications, the DS3172 is currently in active production through Rochester Electronics's standard distribution channels. | — | 1,510 In Stock | $175.24 | ACTIVE | RFQ |