| XCV300E-7FG456C0773 | Gates & Inverters | The XCV300E-7FG456C0773 is a combinational logic IC manufactured by Rochester Electronics. Design review should confirm logic family, I/O voltage, propagation delay, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for consumer electronics, industrial control, and telecommunications applications, the XCV300E-7FG456C0773 is currently in active production through Rochester Electronics's standard distribution channels. | — | 1.504 In Stock | $231.38 | ACTIVE | RFQ |
| XCV300E-7PQ240C0773 | Gates & Inverters | The XCV300E-7PQ240C0773 is a combinational logic IC manufactured by Rochester Electronics. Design review should confirm logic family, I/O voltage, propagation delay, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for consumer electronics, industrial control, and telecommunications applications, the XCV300E-7PQ240C0773 is currently in active production through Rochester Electronics's standard distribution channels. | — | 1.517 In Stock | $180.38 | ACTIVE | RFQ |
| XCV400-4BG560I | FPGAs | The XCV400-4BG560I is an FPGA manufactured by Rochester Electronics. Key technical specifications include 10800 logic elements, 468252 gates, 2400 LABs/CLBs, 2.375V ~ 2.625V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 560-LBGA Exposed Pad, Metal package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCV400-4BG560I is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 560-LBGA Exposed Pad, Metal | RFQ for sourcing | $1041.26 | OBSOLETE | RFQ |
| XCV400-4HQ240C | FPGAs | The XCV400-4HQ240C is an FPGA manufactured by Rochester Electronics. Key technical specifications include 10800 logic elements, 468252 gates, 2400 LABs/CLBs, 2.375V ~ 2.625V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 240-BFQFP Exposed Pad package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCV400-4HQ240C is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 240-BFQFP Exposed Pad | RFQ for sourcing | $753.24 | OBSOLETE | RFQ |
| XCV400-4HQ240C0729 | Gates & Inverters | The XCV400-4HQ240C0729 is a combinational logic IC manufactured by Rochester Electronics. Design review should confirm logic family, I/O voltage, propagation delay, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for consumer electronics, industrial control, and telecommunications applications, the XCV400-4HQ240C0729 is currently in active production through Rochester Electronics's standard distribution channels. | — | 1.519 In Stock | $647.08 | ACTIVE | RFQ |
| XCV400-5BG560C | FPGAs | The XCV400-5BG560C is an FPGA manufactured by Rochester Electronics. Key technical specifications include 10800 logic elements, 468252 gates, 2400 LABs/CLBs, 2.375V ~ 2.625V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 560-LBGA Exposed Pad, Metal package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCV400-5BG560C is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 560-LBGA Exposed Pad, Metal | RFQ for sourcing | $402.53 | OBSOLETE | RFQ |
| XCV400-5HQ240I | FPGAs | The XCV400-5HQ240I is an FPGA manufactured by Rochester Electronics. Key technical specifications include 10800 logic elements, 468252 gates, 2400 LABs/CLBs, 2.375V ~ 2.625V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 240-BFQFP Exposed Pad package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCV400-5HQ240I is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 240-BFQFP Exposed Pad | RFQ for sourcing | $56.30 | OBSOLETE | RFQ |
| XCV400E-6BG560C0773 | Gates & Inverters | The XCV400E-6BG560C0773 is a combinational logic IC manufactured by Rochester Electronics. Design review should confirm logic family, I/O voltage, propagation delay, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for consumer electronics, industrial control, and telecommunications applications, the XCV400E-6BG560C0773 is currently in active production through Rochester Electronics's standard distribution channels. | — | 1.643 In Stock | $107.52 | ACTIVE | RFQ |
| XCV400E-7BG432C0773 | Gates & Inverters | The XCV400E-7BG432C0773 is a combinational logic IC manufactured by Rochester Electronics. Design review should confirm logic family, I/O voltage, propagation delay, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for consumer electronics, industrial control, and telecommunications applications, the XCV400E-7BG432C0773 is currently in active production through Rochester Electronics's standard distribution channels. | — | 1.570 In Stock | $323.13 | ACTIVE | RFQ |
| XCV600-6BG560C | FPGAs | The XCV600-6BG560C is an FPGA manufactured by Rochester Electronics. Key technical specifications include 15552 logic elements, 661111 gates, 3456 LABs/CLBs, 2.375V ~ 2.625V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 560-LBGA Exposed Pad, Metal package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XCV600-6BG560C is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 560-LBGA Exposed Pad, Metal | RFQ for sourcing | $1107.13 | OBSOLETE | RFQ |
| XCV600E-7BG432C0773 | Gates & Inverters | The XCV600E-7BG432C0773 is a combinational logic IC manufactured by Rochester Electronics. Design review should confirm logic family, I/O voltage, propagation delay, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for consumer electronics, industrial control, and telecommunications applications, the XCV600E-7BG432C0773 is currently in active production through Rochester Electronics's standard distribution channels. | — | 1.514 In Stock | $1518.78 | ACTIVE | RFQ |
| XCV600E-7FG676C0773 | Gates & Inverters | The XCV600E-7FG676C0773 is a combinational logic IC manufactured by Rochester Electronics. Design review should confirm logic family, I/O voltage, propagation delay, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for consumer electronics, industrial control, and telecommunications applications, the XCV600E-7FG676C0773 is currently in active production through Rochester Electronics's standard distribution channels. | — | 1.606 In Stock | $546.76 | ACTIVE | RFQ |
| XCY99008BR2 | DC-DC Switching Controllers | The XCY99008BR2 is a DC-DC switching controller manufactured by Rochester Electronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for battery-powered devices, portable electronics, and industrial sensors applications, the XCY99008BR2 is currently in active production through Rochester Electronics's standard distribution channels. | — | 42.000 In Stock | $0.3091 | ACTIVE | RFQ |
| XD11568PGJ | DSP - Digital Signal Processors | The XD11568PGJ is a digital signal processor manufactured by Rochester Electronics. Design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XD11568PGJ is currently in active production through Rochester Electronics's standard distribution channels. | — | 51.662 In Stock | $4.63 | ACTIVE | RFQ |
| XDPL8220XUMA1CT | LED Drivers | The XDPL8220XUMA1CT is an LED driver IC manufactured by Rochester Electronics. Design review should confirm drive current, MOSFET or LED load compatibility, input voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for motor control, LED lighting, and display backlight applications, the XDPL8220XUMA1CT is currently in active production through Rochester Electronics's standard distribution channels. | — | 5.790 In Stock | $1.25 | ACTIVE | RFQ |
| XDPS21061XUMA1 | DC-DC Switching Controllers | The XDPS21061XUMA1 is a DC-DC switching controller manufactured by Rochester Electronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for battery-powered devices, portable electronics, and industrial sensors applications, the XDPS21061XUMA1 is currently in active production through Rochester Electronics's standard distribution channels. | — | 47.770 In Stock | $1.35 | ACTIVE | RFQ |
| XE164H72F66LACFXQMA1 | Microcontrollers (MCU) | The XE164H72F66LACFXQMA1 is a microcontroller manufactured by Rochester Electronics. Key technical specifications include 576KB (576K x 8) Flash memory, 50K x 8 RAM, 66MHz clock speed, and CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This Surface Mount component is supplied in a 100-LQFP Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XE164H72F66LACFXQMA1 is currently in active production through Rochester Electronics's standard distribution channels. | 100-LQFP Exposed Pad | 46.536 In Stock | $20.02 | ACTIVE | RFQ |
| XF28M36P63C2ZWTT | Microcontrollers (MCU) | The XF28M36P63C2ZWTT is a microcontroller manufactured by Rochester Electronics. Key technical specifications include 512KB/1MB Flash memory, 232KB RAM, 125MHz/150MHz clock speed, and CANbus, EBI/EMI, Ethernet, I²C, IrDA, McBSP, SCI, SPI, SSI, UART/USART, USB OTG connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This Surface Mount component is supplied in a 289-LFBGA package and is rated for operation across -40°C ~ 105°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XF28M36P63C2ZWTT is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 289-LFBGA | RFQ for sourcing | $62.02 | OBSOLETE | RFQ |
| XFD10P03L | Specialized ICs | The XFD10P03L is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the XFD10P03L is currently in active production through Rochester Electronics's standard distribution channels. | — | 1.233 In Stock | RFQ | ACTIVE | RFQ |
| XFD10P03LSM | Specialized ICs | The XFD10P03LSM is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the XFD10P03LSM is currently in active production through Rochester Electronics's standard distribution channels. | — | 1.084 In Stock | RFQ | ACTIVE | RFQ |