| MB89615RPMC-G-662-JNE1 | Microcontrollers (MCU) | The MB89615RPMC-G-662-JNE1 is a microcontroller manufactured by Spansion. Key technical specifications include 16KB (16K x 8) Flash memory, 512 x 8 RAM, 10MHz clock speed, and Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This - component is supplied in a standard package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89615RPMC-G-662-JNE1 is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| MB89615RPMC-G-XXX-BND | Microcontrollers (MCU) | The MB89615RPMC-G-XXX-BND is a microcontroller manufactured by Spansion. Key technical specifications include 16KB (16K x 8) Flash memory, 512 x 8 RAM, 10MHz clock speed, and Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This - component is supplied in a standard package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89615RPMC-G-XXX-BND is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| MB89615RPMC-G-XXX-BNDE1 | Microcontrollers (MCU) | The MB89615RPMC-G-XXX-BNDE1 is a microcontroller manufactured by Spansion. Key technical specifications include 16KB (16K x 8) Flash memory, 512 x 8 RAM, 10MHz clock speed, and Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This - component is supplied in a standard package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89615RPMC-G-XXX-BNDE1 is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| MB89615RPMC-G-XXX-JNE1 | Microcontrollers (MCU) | The MB89615RPMC-G-XXX-JNE1 is a microcontroller manufactured by Spansion. Key technical specifications include 16KB (16K x 8) Flash memory, 512 x 8 RAM, 10MHz clock speed, and Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This - component is supplied in a standard package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89615RPMC-G-XXX-JNE1 is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| MB89623P-GT-125-SHE1 | Microcontrollers (MCU) | The MB89623P-GT-125-SHE1 is a microcontroller manufactured by Spansion. Key technical specifications include 8KB (8K x 8) Flash memory, 256 x 8 RAM, 10MHz clock speed, and EBI/EMI, Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This Through Hole component is supplied in a 64-DIP (0.750", 19.05mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89623P-GT-125-SHE1 is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | 64-DIP (0.750", 19.05mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| MB89623P-GT-XXX-SH | Microcontrollers (MCU) | The MB89623P-GT-XXX-SH is a microcontroller manufactured by Spansion. Key technical specifications include 8KB (8K x 8) Flash memory, 256 x 8 RAM, 10MHz clock speed, and EBI/EMI, Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This Through Hole component is supplied in a 64-DIP (0.750", 19.05mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89623P-GT-XXX-SH is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | 64-DIP (0.750", 19.05mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| MB89623PF-G-XXX-BND | Microcontrollers (MCU) | The MB89623PF-G-XXX-BND is a microcontroller manufactured by Spansion. Key technical specifications include 8KB (8K x 8) Flash memory, 256 x 8 RAM, 10MHz clock speed, and EBI/EMI, Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This Surface Mount component is supplied in a 64-BQFP package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89623PF-G-XXX-BND is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | 64-BQFP | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| MB89623RP-G-XXX-SH | Microcontrollers (MCU) | The MB89623RP-G-XXX-SH is a microcontroller manufactured by Spansion. Key technical specifications include 8KB (8K x 8) Flash memory, 256 x 8 RAM, 10MHz clock speed, and EBI/EMI, Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This Through Hole component is supplied in a 64-DIP (0.750", 19.05mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89623RP-G-XXX-SH is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | 64-DIP (0.750", 19.05mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| MB89623RPF-G-360-BNDE1 | Microcontrollers (MCU) | The MB89623RPF-G-360-BNDE1 is a microcontroller manufactured by Spansion. Key technical specifications include 8KB (8K x 8) Flash memory, 256 x 8 RAM, 10MHz clock speed, and EBI/EMI, Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This Surface Mount component is supplied in a 64-BQFP package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89623RPF-G-360-BNDE1 is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | 64-BQFP | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| MB89623RPF-G-407-BNDE1 | Microcontrollers (MCU) | The MB89623RPF-G-407-BNDE1 is a microcontroller manufactured by Spansion. Key technical specifications include 8KB (8K x 8) Flash memory, 256 x 8 RAM, 10MHz clock speed, and EBI/EMI, Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This Surface Mount component is supplied in a 64-BQFP package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89623RPF-G-407-BNDE1 is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | 64-BQFP | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| MB89623RPF-G-407-TLE1 | Microcontrollers (MCU) | The MB89623RPF-G-407-TLE1 is a microcontroller manufactured by Spansion. Key technical specifications include 8KB (8K x 8) Flash memory, 256 x 8 RAM, 10MHz clock speed, and EBI/EMI, Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This Surface Mount component is supplied in a 64-BQFP package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89623RPF-G-407-TLE1 is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | 64-BQFP | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| MB89623RPF-G-XXX-BND | Microcontrollers (MCU) | The MB89623RPF-G-XXX-BND is a microcontroller manufactured by Spansion. Key technical specifications include 8KB (8K x 8) Flash memory, 256 x 8 RAM, 10MHz clock speed, and EBI/EMI, Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This Surface Mount component is supplied in a 64-BQFP package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89623RPF-G-XXX-BND is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | 64-BQFP | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| MB89623RPF-G-XXX-BNDE1 | Microcontrollers (MCU) | The MB89623RPF-G-XXX-BNDE1 is a microcontroller manufactured by Spansion. Key technical specifications include 8KB (8K x 8) Flash memory, 256 x 8 RAM, 10MHz clock speed, and EBI/EMI, Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This Surface Mount component is supplied in a 64-BQFP package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89623RPF-G-XXX-BNDE1 is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | 64-BQFP | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| MB89623RPMC-G-283-BNDE1 | Microcontrollers (MCU) | The MB89623RPMC-G-283-BNDE1 is a microcontroller manufactured by Spansion. Key technical specifications include 8KB (8K x 8) Flash memory, 256 x 8 RAM, 10MHz clock speed, and EBI/EMI, Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This Surface Mount component is supplied in a 64-LQFP package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89623RPMC-G-283-BNDE1 is currently in active production through Spansion's standard distribution channels. | 64-LQFP | 6.294 In Stock | $8.17 | ACTIVE | RFQ |
| MB89623RPMC-G-XXX-BNDE1 | Microcontrollers (MCU) | The MB89623RPMC-G-XXX-BNDE1 is a microcontroller manufactured by Spansion. Key technical specifications include 8KB (8K x 8) Flash memory, 256 x 8 RAM, 10MHz clock speed, and EBI/EMI, Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This Surface Mount component is supplied in a 64-LQFP package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89623RPMC-G-XXX-BNDE1 is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | 64-LQFP | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| MB89625RP-G-1072-SHE1 | Microcontrollers (MCU) | The MB89625RP-G-1072-SHE1 is a microcontroller manufactured by Spansion. Key technical specifications include 16KB (16K x 8) Flash memory, 512 x 8 RAM, 10MHz clock speed, and EBI/EMI, Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This Through Hole component is supplied in a 64-DIP (0.750", 19.05mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89625RP-G-1072-SHE1 is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | 64-DIP (0.750", 19.05mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| MB89625RP-G-1074-SHE1 | Microcontrollers (MCU) | The MB89625RP-G-1074-SHE1 is a microcontroller manufactured by Spansion. Key technical specifications include 16KB (16K x 8) Flash memory, 512 x 8 RAM, 10MHz clock speed, and EBI/EMI, Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This Through Hole component is supplied in a 64-DIP (0.750", 19.05mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89625RP-G-1074-SHE1 is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | 64-DIP (0.750", 19.05mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| MB89625RP-G-1103-SHE1 | Microcontrollers (MCU) | The MB89625RP-G-1103-SHE1 is a microcontroller manufactured by Spansion. Key technical specifications include 16KB (16K x 8) Flash memory, 512 x 8 RAM, 10MHz clock speed, and EBI/EMI, Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This Through Hole component is supplied in a 64-DIP (0.750", 19.05mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89625RP-G-1103-SHE1 is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | 64-DIP (0.750", 19.05mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| MB89625RP-G-XXX-SHE1 | Microcontrollers (MCU) | The MB89625RP-G-XXX-SHE1 is a microcontroller manufactured by Spansion. Key technical specifications include 16KB (16K x 8) Flash memory, 512 x 8 RAM, 10MHz clock speed, and EBI/EMI, Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This Through Hole component is supplied in a 64-DIP (0.750", 19.05mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89625RP-G-XXX-SHE1 is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | 64-DIP (0.750", 19.05mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| MB89625RPF-G-1114E1 | Microcontrollers (MCU) | The MB89625RPF-G-1114E1 is a microcontroller manufactured by Spansion. Key technical specifications include 16KB (16K x 8) Flash memory, 512 x 8 RAM, 10MHz clock speed, and EBI/EMI, Serial I/O connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This Surface Mount component is supplied in a 64-BQFP package and is rated for operation across -40°C ~ 85°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the MB89625RPF-G-1114E1 is no longer produced by Spansion; FPGACenter maintains verified stock sourced through certified supply chain partners. | 64-BQFP | RFQ for sourcing | RFQ | OBSOLETE | RFQ |