| XC4052XL-1HQ240C | FPGAs | The XC4052XL-1HQ240C is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 240-BFQFP Exposed Pad package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-1HQ240C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 240-BFQFP Exposed Pad | RFQ for sourcing | $779.70 | OBSOLETE | RFQ |
| XC4052XL-1HQ240I | FPGAs | The XC4052XL-1HQ240I is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 240-BFQFP Exposed Pad package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-1HQ240I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 240-BFQFP Exposed Pad | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC4052XL-1HQ304I | FPGAs | The XC4052XL-1HQ304I is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 304-BFQFP Exposed Pad package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-1HQ304I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 304-BFQFP Exposed Pad | RFQ for sourcing | $1106.30 | OBSOLETE | RFQ |
| XC4052XL-2BG432C | FPGAs | The XC4052XL-2BG432C is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 432-LBGA Exposed Pad, Metal package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-2BG432C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 432-LBGA Exposed Pad, Metal | RFQ for sourcing | $607.20 | OBSOLETE | RFQ |
| XC4052XL-2BG432I | FPGAs | The XC4052XL-2BG432I is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 432-LBGA Exposed Pad, Metal package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-2BG432I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 432-LBGA Exposed Pad, Metal | RFQ for sourcing | $759.00 | OBSOLETE | RFQ |
| XC4052XL-2BG560C | FPGAs | The XC4052XL-2BG560C is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 560-LBGA Exposed Pad, Metal package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-2BG560C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 560-LBGA Exposed Pad, Metal | RFQ for sourcing | $634.80 | OBSOLETE | RFQ |
| XC4052XL-2BG560I | FPGAs | The XC4052XL-2BG560I is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 560-LBGA Exposed Pad, Metal package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-2BG560I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 560-LBGA Exposed Pad, Metal | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC4052XL-2HQ240C | FPGAs | The XC4052XL-2HQ240C is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 240-BFQFP Exposed Pad package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-2HQ240C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 240-BFQFP Exposed Pad | RFQ for sourcing | $84.65 | OBSOLETE | RFQ |
| XC4052XL-2HQ240I | FPGAs | The XC4052XL-2HQ240I is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 240-BFQFP Exposed Pad package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-2HQ240I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 240-BFQFP Exposed Pad | RFQ for sourcing | $722.20 | OBSOLETE | RFQ |
| XC4052XL-2HQ304C | FPGAs | The XC4052XL-2HQ304C is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 304-BFQFP Exposed Pad package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-2HQ304C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 304-BFQFP Exposed Pad | RFQ for sourcing | $607.20 | OBSOLETE | RFQ |
| XC4052XL-2HQ304I | FPGAs | The XC4052XL-2HQ304I is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 304-BFQFP Exposed Pad package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-2HQ304I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 304-BFQFP Exposed Pad | RFQ for sourcing | $759.00 | OBSOLETE | RFQ |
| XC4052XL-3BG432C | FPGAs | The XC4052XL-3BG432C is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 432-LBGA Exposed Pad, Metal package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-3BG432C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 432-LBGA Exposed Pad, Metal | RFQ for sourcing | $466.90 | OBSOLETE | RFQ |
| XC4052XL-3BG432I | FPGAs | The XC4052XL-3BG432I is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 432-LBGA Exposed Pad, Metal package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-3BG432I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 432-LBGA Exposed Pad, Metal | RFQ for sourcing | $584.20 | OBSOLETE | RFQ |
| XC4052XL-3BG560C | FPGAs | The XC4052XL-3BG560C is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 560-LBGA Exposed Pad, Metal package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-3BG560C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 560-LBGA Exposed Pad, Metal | RFQ for sourcing | $0.0164 | OBSOLETE | RFQ |
| XC4052XL-3BG560I | FPGAs | The XC4052XL-3BG560I is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 560-LBGA Exposed Pad, Metal package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-3BG560I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 560-LBGA Exposed Pad, Metal | RFQ for sourcing | $611.80 | OBSOLETE | RFQ |
| XC4052XL-3HQ240C | FPGAs | The XC4052XL-3HQ240C is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 240-BFQFP Exposed Pad package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-3HQ240C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 240-BFQFP Exposed Pad | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC4052XL-3HQ240I | FPGAs | The XC4052XL-3HQ240I is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 240-BFQFP Exposed Pad package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-3HQ240I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 240-BFQFP Exposed Pad | RFQ for sourcing | $556.60 | OBSOLETE | RFQ |
| XC4052XL-3HQ304C | FPGAs | The XC4052XL-3HQ304C is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 304-BFQFP Exposed Pad package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-3HQ304C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 304-BFQFP Exposed Pad | RFQ for sourcing | $65.62 | OBSOLETE | RFQ |
| XC4052XL-3HQ304I | FPGAs | The XC4052XL-3HQ304I is an FPGA manufactured by Xilinx. Key technical specifications include 4598 logic elements, 52000 gates, 1936 LABs/CLBs, 3V ~ 3.6V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 304-BFQFP Exposed Pad package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4052XL-3HQ304I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 304-BFQFP Exposed Pad | RFQ for sourcing | $584.20 | OBSOLETE | RFQ |
| XC4062XL-09BG560C | FPGAs | The XC4062XL-09BG560C is an FPGA manufactured by Xilinx. Key technical specifications include 5472 logic elements, 62000 gates, 2304 LABs/CLBs, 3V ~ 3.6V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 560-LBGA Exposed Pad, Metal package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4062XL-09BG560C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 560-LBGA Exposed Pad, Metal | RFQ for sourcing | RFQ | OBSOLETE | RFQ |