| XAZU2EG-1SFVC784I | System On Chip (SoC) | The XAZU2EG-1SFVC784I is a system-on-chip manufactured by Xilinx. Key technical specifications include 1.2MB RAM, 500MHz, 1.2GHz clock speed, and CANbus, I²C, SPI, UART/USART, USB connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 784-BFBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XAZU2EG-1SFVC784I is currently in active production through Xilinx's standard distribution channels. | 784-BFBGA, FCBGA | 1.531 In Stock | $396.19 | ACTIVE | RFQ |
| XAZU2EG-L1SFVA625I | System On Chip (SoC) | The XAZU2EG-L1SFVA625I is a system-on-chip manufactured by Xilinx. Key technical specifications include 1.2MB RAM, 500MHz, 1.2GHz clock speed, and CANbus, I²C, SPI, UART/USART, USB connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 625-BFBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XAZU2EG-L1SFVA625I is currently in active production through Xilinx's standard distribution channels. | 625-BFBGA, FCBGA | 2.774 In Stock | $1006.20 | ACTIVE | RFQ |
| XAZU2EG-L1SFVC784I | System On Chip (SoC) | The XAZU2EG-L1SFVC784I is a system-on-chip manufactured by Xilinx. Key technical specifications include 1.2MB RAM, 500MHz, 1.2GHz clock speed, and CANbus, I²C, SPI, UART/USART, USB connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 784-BFBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XAZU2EG-L1SFVC784I is currently in active production through Xilinx's standard distribution channels. | 784-BFBGA, FCBGA | 1.678 In Stock | $1034.80 | ACTIVE | RFQ |
| XAZU3EG-1SBVA484Q | System On Chip (SoC) | The XAZU3EG-1SBVA484Q is a system-on-chip manufactured by Xilinx. Key technical specifications include 1.8MB RAM, 500MHz, 1.2GHz clock speed, and CANbus, I²C, SPI, UART/USART, USB connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 484-BFBGA, FCBGA package and is rated for operation across -40°C ~ 125°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XAZU3EG-1SBVA484Q is currently in active production through Xilinx's standard distribution channels. | 484-BFBGA, FCBGA | 1.863 In Stock | $2228.20 | ACTIVE | RFQ |
| XAZU3EG-1SFVA625I | System On Chip (SoC) | The XAZU3EG-1SFVA625I is a system-on-chip manufactured by Xilinx. Key technical specifications include 1.8MB RAM, 500MHz, 1.2GHz clock speed, and CANbus, I²C, SPI, UART/USART, USB connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 625-BFBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XAZU3EG-1SFVA625I is currently in active production through Xilinx's standard distribution channels. | 625-BFBGA, FCBGA | 1.502 In Stock | $1389.38 | ACTIVE | RFQ |
| XAZU3EG-1SFVA625Q | System On Chip (SoC) | The XAZU3EG-1SFVA625Q is a system-on-chip manufactured by Xilinx. Key technical specifications include 1.8MB RAM, 500MHz, 1.2GHz clock speed, and CANbus, I²C, SPI, UART/USART, USB connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 625-BFBGA, FCBGA package and is rated for operation across -40°C ~ 125°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XAZU3EG-1SFVA625Q is currently in active production through Xilinx's standard distribution channels. | 625-BFBGA, FCBGA | 719 In Stock | $2339.78 | ACTIVE | RFQ |
| XAZU3EG-1SFVC784I | System On Chip (SoC) | The XAZU3EG-1SFVC784I is a system-on-chip manufactured by Xilinx. Key technical specifications include 1.8MB RAM, 500MHz, 1.2GHz clock speed, and CANbus, I²C, SPI, UART/USART, USB connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 784-BFBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XAZU3EG-1SFVC784I is currently in active production through Xilinx's standard distribution channels. | 784-BFBGA, FCBGA | 3.330 In Stock | $589.09 | ACTIVE | RFQ |
| XAZU3EG-1SFVC784Q | System On Chip (SoC) | The XAZU3EG-1SFVC784Q is a system-on-chip manufactured by Xilinx. Key technical specifications include 1.8MB RAM, 500MHz, 1.2GHz clock speed, and CANbus, I²C, SPI, UART/USART, USB connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 784-BFBGA, FCBGA package and is rated for operation across -40°C ~ 125°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XAZU3EG-1SFVC784Q is currently in active production through Xilinx's standard distribution channels. | 784-BFBGA, FCBGA | 2.039 In Stock | $2407.38 | ACTIVE | RFQ |
| XAZU3EG-L1SFVA625I | System On Chip (SoC) | The XAZU3EG-L1SFVA625I is a system-on-chip manufactured by Xilinx. Key technical specifications include 1.8MB RAM, 500MHz, 1.2GHz clock speed, and CANbus, I²C, SPI, UART/USART, USB connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 625-BFBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XAZU3EG-L1SFVA625I is currently in active production through Xilinx's standard distribution channels. | 625-BFBGA, FCBGA | 1.262 In Stock | $1570.40 | ACTIVE | RFQ |
| XAZU3EG-L1SFVC784I | System On Chip (SoC) | The XAZU3EG-L1SFVC784I is a system-on-chip manufactured by Xilinx. Key technical specifications include 1.8MB RAM, 500MHz, 1.2GHz clock speed, and CANbus, I²C, SPI, UART/USART, USB connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 784-BFBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XAZU3EG-L1SFVC784I is currently in active production through Xilinx's standard distribution channels. | 784-BFBGA, FCBGA | 1.630 In Stock | $1774.29 | ACTIVE | RFQ |
| XAZU4EV-1SFVC784I | System On Chip (SoC) | The XAZU4EV-1SFVC784I is a system-on-chip manufactured by Xilinx. Key technical specifications include 256kB RAM, 500MHz, 600MHz, 1.2GHz clock speed, and CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 784-BFBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XAZU4EV-1SFVC784I is currently in active production through Xilinx's standard distribution channels. | 784-BFBGA, FCBGA | 2.034 In Stock | RFQ | ACTIVE | RFQ |
| XAZU4EV-1SFVC784Q | System On Chip (SoC) | The XAZU4EV-1SFVC784Q is a system-on-chip manufactured by Xilinx. Key technical specifications include 256kB RAM, 500MHz, 600MHz, 1.2GHz clock speed, and CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 784-BFBGA, FCBGA package and is rated for operation across -40°C ~ 125°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XAZU4EV-1SFVC784Q is currently in active production through Xilinx's standard distribution channels. | 784-BFBGA, FCBGA | 1.503 In Stock | $5143.16 | ACTIVE | RFQ |
| XAZU4EV-L1SFVC784I | System On Chip (SoC) | The XAZU4EV-L1SFVC784I is a system-on-chip manufactured by Xilinx. Key technical specifications include 256kB RAM, 500MHz, 600MHz, 1.2GHz clock speed, and CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 784-BFBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XAZU4EV-L1SFVC784I is currently in active production through Xilinx's standard distribution channels. | 784-BFBGA, FCBGA | 2.421 In Stock | $3517.50 | ACTIVE | RFQ |
| XAZU5EV-1SFVC784I | System On Chip (SoC) | The XAZU5EV-1SFVC784I is a system-on-chip manufactured by Xilinx. Key technical specifications include 256kB RAM, 500MHz, 600MHz, 1.2GHz clock speed, and CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 784-BFBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XAZU5EV-1SFVC784I is currently in active production through Xilinx's standard distribution channels. | 784-BFBGA, FCBGA | 1.509 In Stock | $4554.16 | ACTIVE | RFQ |
| XAZU5EV-1SFVC784Q | System On Chip (SoC) | The XAZU5EV-1SFVC784Q is a system-on-chip manufactured by Xilinx. Key technical specifications include 256kB RAM, 500MHz, 600MHz, 1.2GHz clock speed, and CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 784-BFBGA, FCBGA package and is rated for operation across -40°C ~ 125°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XAZU5EV-1SFVC784Q is currently in active production through Xilinx's standard distribution channels. | 784-BFBGA, FCBGA | 5.172 In Stock | $101.45 | ACTIVE | RFQ |
| XAZU5EV-L1SFVC784I | System On Chip (SoC) | The XAZU5EV-L1SFVC784I is a system-on-chip manufactured by Xilinx. Key technical specifications include 256kB RAM, 500MHz, 600MHz, 1.2GHz clock speed, and CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 784-BFBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XAZU5EV-L1SFVC784I is currently in active production through Xilinx's standard distribution channels. | 784-BFBGA, FCBGA | 1.169 In Stock | $5965.71 | ACTIVE | RFQ |
| XAZU7EV-1FBVB900I | System On Chip (SoC) | The XAZU7EV-1FBVB900I is a system-on-chip manufactured by Xilinx. Key technical specifications include 256kB RAM, 500MHz, 600MHz, 1.2GHz clock speed, and CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 900-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XAZU7EV-1FBVB900I is currently in active production through Xilinx's standard distribution channels. | 900-BBGA, FCBGA | 1.255 In Stock | $7470.00 | ACTIVE | RFQ |
| XAZU7EV-1FBVB900Q | System On Chip (SoC) | The XAZU7EV-1FBVB900Q is a system-on-chip manufactured by Xilinx. Key technical specifications include 256kB RAM, 500MHz, 600MHz, 1.2GHz clock speed, and CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 900-BBGA, FCBGA package and is rated for operation across -40°C ~ 125°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XAZU7EV-1FBVB900Q is currently in active production through Xilinx's standard distribution channels. | 900-BBGA, FCBGA | 1.536 In Stock | $5343.22 | ACTIVE | RFQ |
| XC1701LPCG20C | Configuration PROMs for FPGAs | The XC1701LPCG20C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1701LPCG20C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-LCC (J-Lead) | RFQ for sourcing | $20.70 | OBSOLETE | RFQ |
| XC1701LPCG20I | Configuration PROMs for FPGAs | The XC1701LPCG20I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1701LPCG20I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-LCC (J-Lead) | RFQ for sourcing | $24.50 | OBSOLETE | RFQ |