| XC17512LPD8C | Configuration PROMs for FPGAs | The XC17512LPD8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17512LPD8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $19.78 | OBSOLETE | RFQ |
| XC17512LPD8I | Configuration PROMs for FPGAs | The XC17512LPD8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17512LPD8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $23.11 | OBSOLETE | RFQ |
| XC17512LSO20I | Configuration PROMs for FPGAs | The XC17512LSO20I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17512LSO20I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $24.63 | OBSOLETE | RFQ |
| XC1765ELPC20I | Configuration PROMs for FPGAs | The XC1765ELPC20I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1765ELPC20I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-LCC (J-Lead) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC1765ELPD8C | Configuration PROMs for FPGAs | The XC1765ELPD8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1765ELPD8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC1765ELPD8I | Configuration PROMs for FPGAs | The XC1765ELPD8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1765ELPD8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC1765ELSO8I | Configuration PROMs for FPGAs | The XC1765ELSO8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1765ELSO8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $18.00 | OBSOLETE | RFQ |
| XC1765EPC20C | Configuration PROMs for FPGAs | The XC1765EPC20C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1765EPC20C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-LCC (J-Lead) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC1765EPC20I | Configuration PROMs for FPGAs | The XC1765EPC20I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1765EPC20I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-LCC (J-Lead) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC1765EPD8C | Configuration PROMs for FPGAs | The XC1765EPD8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1765EPD8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC1765EPD8I | Configuration PROMs for FPGAs | The XC1765EPD8I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1765EPD8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC1765EPDG8C | Configuration PROMs for FPGAs | The XC1765EPDG8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1765EPDG8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC1765ESO8C | Configuration PROMs for FPGAs | The XC1765ESO8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1765ESO8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC1765ESO8I | Configuration PROMs for FPGAs | The XC1765ESO8I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1765ESO8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC17S05PD8C | Configuration PROMs for FPGAs | The XC17S05PD8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S05PD8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $5.80 | OBSOLETE | RFQ |
| XC17S05PD8I | Configuration PROMs for FPGAs | The XC17S05PD8I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S05PD8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $6.82 | OBSOLETE | RFQ |
| XC17S05VO8C | Configuration PROMs for FPGAs | The XC17S05VO8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S05VO8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $7.75 | OBSOLETE | RFQ |
| XC17S05VO8I | Configuration PROMs for FPGAs | The XC17S05VO8I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S05VO8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $9.33 | OBSOLETE | RFQ |
| XC17S05XLPD8C | Configuration PROMs for FPGAs | The XC17S05XLPD8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S05XLPD8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $4.76 | OBSOLETE | RFQ |
| XC17S05XLPD8I | Configuration PROMs for FPGAs | The XC17S05XLPD8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S05XLPD8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |