| XC17S05XLVO8C | Configuration PROMs for FPGAs | The XC17S05XLVO8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S05XLVO8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $8.02 | OBSOLETE | RFQ |
| XC17S05XLVO8I | Configuration PROMs for FPGAs | The XC17S05XLVO8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S05XLVO8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $8.02 | OBSOLETE | RFQ |
| XC17S100APD8C | Configuration PROMs for FPGAs | The XC17S100APD8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S100APD8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC17S100APD8I | Configuration PROMs for FPGAs | The XC17S100APD8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S100APD8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC17S100ASO20C | Configuration PROMs for FPGAs | The XC17S100ASO20C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-SOIC (0.295", 7.50mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S100ASO20C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC17S100ASO20I | Configuration PROMs for FPGAs | The XC17S100ASO20I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S100ASO20I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC17S100AVO8C | Configuration PROMs for FPGAs | The XC17S100AVO8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S100AVO8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC17S100AVO8I | Configuration PROMs for FPGAs | The XC17S100AVO8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S100AVO8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $0.0090 | OBSOLETE | RFQ |
| XC17S100AVOG8C | Configuration PROMs for FPGAs | The XC17S100AVOG8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S100AVOG8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC17S10PD8C | Configuration PROMs for FPGAs | The XC17S10PD8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S10PD8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $8.40 | OBSOLETE | RFQ |
| XC17S10PD8I | Configuration PROMs for FPGAs | The XC17S10PD8I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S10PD8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $10.12 | OBSOLETE | RFQ |
| XC17S10VO8C | Configuration PROMs for FPGAs | The XC17S10VO8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S10VO8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $11.27 | OBSOLETE | RFQ |
| XC17S10VO8I | Configuration PROMs for FPGAs | The XC17S10VO8I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S10VO8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $13.32 | OBSOLETE | RFQ |
| XC17S10VOG8C | Configuration PROMs for FPGAs | The XC17S10VOG8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S10VOG8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $9.43 | OBSOLETE | RFQ |
| XC17S10XLPD8C | Configuration PROMs for FPGAs | The XC17S10XLPD8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S10XLPD8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $93.84 | OBSOLETE | RFQ |
| XC17S10XLPD8I | Configuration PROMs for FPGAs | The XC17S10XLPD8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S10XLPD8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $7.74 | OBSOLETE | RFQ |
| XC17S10XLPDG8C | Configuration PROMs for FPGAs | The XC17S10XLPDG8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S10XLPDG8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $7.77 | OBSOLETE | RFQ |
| XC17S10XLVO8C | Configuration PROMs for FPGAs | The XC17S10XLVO8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S10XLVO8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $8.94 | OBSOLETE | RFQ |
| XC17S10XLVO8I | Configuration PROMs for FPGAs | The XC17S10XLVO8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S10XLVO8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $10.63 | OBSOLETE | RFQ |
| XC17S10XLVOG8C | Configuration PROMs for FPGAs | The XC17S10XLVOG8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S10XLVOG8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $7.46 | OBSOLETE | RFQ |