Component category
Power Distribution Switches
Find Power Distribution Switches from ST, Texas Instruments, and additional brands. 6,768 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Maxim Integrated | The MAX894LESA+ is a power distribution IC manufactured by Maxim Integrated. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MAX894LESA+ is currently in active production through Maxim Integrated's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 12,142 In Stock | $6.21 | 1 | ACTIVE | ||
| Maxim Integrated | The MAX894LESA+T is a power distribution IC manufactured by Maxim Integrated. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MAX894LESA+T is currently in active production through Maxim Integrated's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 2,808 In Stock | $12.13 | 1 | ACTIVE | ||
| Maxim Integrated | The MAX8951EWC+ is a power distribution IC manufactured by Maxim Integrated. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MAX8951EWC+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Maxim Integrated | The MAX8951EWC+T is a power distribution IC manufactured by Maxim Integrated. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MAX8951EWC+T is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Maxim Integrated | The MAX895LESA+ is a power distribution IC manufactured by Maxim Integrated. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MAX895LESA+ is currently in active production through Maxim Integrated's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 12,024 In Stock | $5.62 | 1 | ACTIVE | ||
| Maxim Integrated | The MAX895LESA+T is a power distribution IC manufactured by Maxim Integrated. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MAX895LESA+T is currently in active production through Maxim Integrated's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 1,918 In Stock | $8.10 | 1 | ACTIVE | ||
| NXP Semiconductors | The MC06XS3517AFK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 24-PowerQFN package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XS3517AFK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-PowerQFN | RFQ for sourcing | $14.59 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC06XS3517AFKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 24-PowerQFN package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XS3517AFKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-PowerQFN | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC06XS4200BFK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XS4200BFK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 23-PowerQFN | RFQ for sourcing | $10.20 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC06XS4200BFKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XS4200BFKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 23-PowerQFN | RFQ for sourcing | $28.13 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC06XS4200CFK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 23-PQFN (12x12) package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XS4200CFK is currently in active production through NXP Semiconductors's standard distribution channels. | Check | 580 In Stock | $18.00 | 1 | ACTIVE | ||
| NXP Semiconductors | The MC06XS4200CFKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 23-PQFN (12x12) package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XS4200CFKR2 is currently in active production through NXP Semiconductors's standard distribution channels. | Check | 839 In Stock | $22.08 | 1 | ACTIVE | ||
| NXP Semiconductors | The MC06XS4200DFK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 23-PQFN (12x12) package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XS4200DFK is currently in active production through NXP Semiconductors's standard distribution channels. | Check | 1,577 In Stock | $9.98 | 1 | ACTIVE | ||
| NXP Semiconductors | The MC06XS4200DFKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 23-PQFN (12x12) package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XS4200DFKR2 is currently in active production through NXP Semiconductors's standard distribution channels. | Check | 2,273 In Stock | $22.40 | 1 | ACTIVE | ||
| NXP Semiconductors | The MC06XS4200FK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XS4200FK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 23-PowerQFN | RFQ for sourcing | $28.13 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC06XS4200FKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XS4200FKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 23-PowerQFN | RFQ for sourcing | $28.13 | 1 | OBSOLETE | ||
| Rochester Electronics | The MC06XSD200FK is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XSD200FK is currently in active production through Rochester Electronics's standard distribution channels. | 23-PowerQFN | 2,640 In Stock | RFQ | 1 | ACTIVE | ||
| NXP Semiconductors | The MC06XSD200FKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XSD200FKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 23-PowerQFN | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC07XS3200EK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XS3200EK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $2.88 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC07XS3200EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XS3200EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $12.89 | 1 | OBSOLETE |