Component category
Power Distribution Switches
Find Power Distribution Switches from ST, Texas Instruments, and additional brands. 6,768 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| NXP Semiconductors | The MC07XS6517BEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XS6517BEK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC07XS6517BEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XS6517BEKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $23.78 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC07XS6517DEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XS6517DEK is currently in active production through NXP Semiconductors's standard distribution channels. | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | 7.207 In Stock | $10.08 | 1 | ACTIVE | ||
| NXP Semiconductors | The MC07XS6517DEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XS6517DEKR2 is currently in active production through NXP Semiconductors's standard distribution channels. | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | 43.200 In Stock | $6.56 | 1 | ACTIVE | ||
| NXP Semiconductors | The MC07XS6517EK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XS6517EK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC07XS6517EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XS6517EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC07XSC200EK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSC200EK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC07XSC200EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSC200EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC07XSF517BEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSF517BEK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC07XSF517BEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSF517BEKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The MC07XSF517EK is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSF517EK is currently in active production through Rochester Electronics's standard distribution channels. | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | 1.552 In Stock | $4.98 | 1 | ACTIVE | ||
| NXP Semiconductors | The MC07XSF517EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSF517EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $15.78 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC07XSG517DEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 54-HSOP package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSG517DEK is currently in active production through NXP Semiconductors's standard distribution channels. | Check | 1.524 In Stock | $8.62 | 1 | ACTIVE | ||
| NXP Semiconductors | The MC07XSG517DEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 54-HSOP package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSG517DEKR2 is currently in active production through NXP Semiconductors's standard distribution channels. | Check | 2.507 In Stock | $16.42 | 1 | ACTIVE | ||
| NXP Semiconductors | The MC07XSG517EK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSG517EK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $9.60 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC07XSG517EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSG517EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $20.45 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC08XS6421BEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC08XS6421BEK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $12.26 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC08XS6421BEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC08XS6421BEKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC08XS6421CEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC08XS6421CEK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC08XS6421DEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC08XS6421DEK is currently in active production through NXP Semiconductors's standard distribution channels. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 1.538 In Stock | $7.05 | 1 | ACTIVE |