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Power Distribution Switches

Find Power Distribution Switches from ST, Texas Instruments, and additional brands. 6,768 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.

Part NumberManufacturerDescriptionPackageStockPriceMOQStatus
Diodes IncorporatedThe PI5USB1457AZAEX is a power distribution IC manufactured by Diodes Incorporated. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-WFDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PI5USB1457AZAEX is no longer produced by Diodes Incorporated; FPGACenter maintains verified stock sourced through certified supply chain partners.8-WFDFN Exposed PadRFQ for sourcingRFQ1OBSOLETE
Diodes IncorporatedThe PI5USB1457ZAEX is a power distribution IC manufactured by Diodes Incorporated. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-WFDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PI5USB1457ZAEX is no longer produced by Diodes Incorporated; FPGACenter maintains verified stock sourced through certified supply chain partners.8-WFDFN Exposed PadRFQ for sourcingRFQ1OBSOLETE
Diodes IncorporatedThe PI5USB2058ZHE is a power distribution IC manufactured by Diodes Incorporated. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 20-WFQFN Exposed Pad package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PI5USB2058ZHE is no longer produced by Diodes Incorporated; FPGACenter maintains verified stock sourced through certified supply chain partners.20-WFQFN Exposed PadRFQ for sourcingRFQ1OBSOLETE
Diodes IncorporatedThe PI5USB2058ZHEX is a power distribution IC manufactured by Diodes Incorporated. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 20-WFQFN Exposed Pad package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PI5USB2058ZHEX is no longer produced by Diodes Incorporated; FPGACenter maintains verified stock sourced through certified supply chain partners.20-WFQFN Exposed PadRFQ for sourcingRFQ1OBSOLETE
Diodes IncorporatedThe PI5USB2546AQZHEX is a power distribution IC manufactured by Diodes Incorporated. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-WFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PI5USB2546AQZHEX is currently in active production through Diodes Incorporated's standard distribution channels.16-WFQFN Exposed Pad7.392 In Stock$1.331ACTIVE
Diodes IncorporatedThe PI5USB2546AZHEX is a power distribution IC manufactured by Diodes Incorporated. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-WFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PI5USB2546AZHEX is currently in active production through Diodes Incorporated's standard distribution channels.16-WFQFN Exposed Pad21.649 In Stock$0.85051ACTIVE
Diodes IncorporatedThe PI5USB2546HZHDEX is a power distribution IC manufactured by Diodes Incorporated. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 16-UQFN (3x3) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PI5USB2546HZHDEX is currently in active production through Diodes Incorporated's standard distribution channels.Check8.400 In Stock$0.93601ACTIVE
Diodes IncorporatedThe PI5USB2546HZHEX is a power distribution IC manufactured by Diodes Incorporated. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 16-TQFN (3x3) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PI5USB2546HZHEX is currently in active production through Diodes Incorporated's standard distribution channels.Check10.500 In Stock$0.84021ACTIVE
Diodes IncorporatedThe PI5USB2546JZHEX is a power distribution IC manufactured by Diodes Incorporated, part of the Automotive, AEC-Q100 series. Technical highlights include -40°C ~ 125°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-WFQFN Exposed Pad package and is rated for operation across -40°C ~ 125°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PI5USB2546JZHEX is currently in active production through Diodes Incorporated's standard distribution channels.16-WFQFN Exposed Pad10.482 In Stock$0.93601ACTIVE
Diodes IncorporatedThe PI5USB2546QZHEX is a power distribution IC manufactured by Diodes Incorporated. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-WFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PI5USB2546QZHEX is currently in active production through Diodes Incorporated's standard distribution channels.16-WFQFN Exposed Pad11.097 In Stock$1.161ACTIVE
Diodes IncorporatedThe PI5USB2546ZHDEX is a power distribution IC manufactured by Diodes Incorporated. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-UFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PI5USB2546ZHDEX is currently in active production through Diodes Incorporated's standard distribution channels.16-UFQFN Exposed Pad10.482 In Stock$1.671ACTIVE
Diodes IncorporatedThe PI5USB2546ZHEX is a power distribution IC manufactured by Diodes Incorporated. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-WFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PI5USB2546ZHEX is currently in active production through Diodes Incorporated's standard distribution channels.16-WFQFN Exposed Pad11.779 In Stock$0.95401ACTIVE
NXP SemiconductorsThe PIP3101-A,127 is a power distribution IC manufactured by NXP Semiconductors. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a TO-220-5 Formed Leads package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PIP3101-A,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.TO-220-5 Formed LeadsRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe PIP3102-R,118 is a power distribution IC manufactured by NXP Semiconductors. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PIP3102-R,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.TO-263-5, D²Pak (4 Leads + Tab), TO-263BBRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe PIP3103-T,115 is a power distribution IC manufactured by NXP Semiconductors. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a TO-261-4, TO-261AA package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PIP3103-T,115 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.TO-261-4, TO-261AARFQ for sourcing$1.211OBSOLETE
NXP SemiconductorsThe PIP3104-P,127 is a power distribution IC manufactured by NXP Semiconductors. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a TO-220-3 package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PIP3104-P,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.TO-220-3RFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe PIP3105-P,127 is a power distribution IC manufactured by NXP Semiconductors. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a TO-220-3 package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PIP3105-P,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.TO-220-3RFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe PIP3107-D,118 is a power distribution IC manufactured by NXP Semiconductors. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a TO-252-3, DPak (2 Leads + Tab), SC-63 package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PIP3107-D,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.TO-252-3, DPak (2 Leads + Tab), SC-63RFQ for sourcing$2.571OBSOLETE
NXP SemiconductorsThe PIP3115-B,118 is a power distribution IC manufactured by NXP Semiconductors. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a TO-263-3, D²Pak (2 Leads + Tab), TO-263AB package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PIP3115-B,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.TO-263-3, D²Pak (2 Leads + Tab), TO-263ABRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe PIP3119-P,127 is a power distribution IC manufactured by NXP Semiconductors. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a TO-220-3 package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the PIP3119-P,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.TO-220-3RFQ for sourcingRFQ1OBSOLETE
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