Component category
Power Management
FPGACenter stocks 226,180 Power Management part numbers across Torex, Texas Instruments, and Rochester. Same-day dispatch on in-stock items.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Microchip | The FP0100N8-G is a current regulator IC manufactured by Microchip. Technical highlights include 0V ~ 100V input voltage and -40°C ~ 125°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-243AA package and is rated for operation across -40°C ~ 125°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FP0100N8-G is currently in active production through Microchip's standard distribution channels. | TO-243AA | 7.316 In Stock | $1.30 | 1 | ACTIVE | ||
| Rochester Electronics | The FPAL30SL60 is a motor driver IC manufactured by Rochester Electronics. Key technical specifications include 400V supply voltage, -55°C ~ 150°C (TJ) operating temperature, and Parallel interface; design review should also confirm drive current, MOSFET or LED load compatibility, and input voltage. This Through Hole component is supplied in a 30-PowerDIP Module package and is rated for operation across -55°C ~ 150°C (TJ). Designed for motor control, LED lighting, and display backlight applications, the FPAL30SL60 is currently in active production through Rochester Electronics's standard distribution channels. | 30-PowerDIP Module | 1.563 In Stock | $22.92 | 1 | ACTIVE | ||
| Rochester Electronics | The FPF1003 is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF1003 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 6-UFBGA, WLCSP | RFQ for sourcing | $0.2735 | 1 | OBSOLETE | ||
| Onsemi | The FPF1003A is a power distribution IC manufactured by Onsemi. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF1003A is currently in active production through Onsemi's standard distribution channels. | 6-UFBGA, WLCSP | 5.670 In Stock | $0.5040 | 1 | ACTIVE | ||
| Rochester Electronics | The FPF1004 is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF1004 is currently in active production through Rochester Electronics's standard distribution channels. | 6-UFBGA, WLCSP | 11.506 In Stock | $0.3567 | 1 | ACTIVE | ||
| Onsemi | The FPF1005 is a power distribution IC manufactured by Onsemi. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF1005 is currently in active production through Onsemi's standard distribution channels. | 6-WDFN Exposed Pad | 18.000 In Stock | $13.70 | 1 | ACTIVE | ||
| Onsemi | The FPF1007 is a power distribution IC manufactured by Onsemi. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF1007 is currently in active production through Onsemi's standard distribution channels. | 6-WDFN Exposed Pad | 9.000 In Stock | $20.27 | 1 | ACTIVE | ||
| Onsemi | The FPF1009R is a power distribution IC manufactured by Onsemi. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF1009R is currently in active production through Onsemi's standard distribution channels. | 6-WDFN Exposed Pad | 3.810 In Stock | $1.61 | 1 | ACTIVE | ||
| Onsemi | The FPF1013_P is a power distribution IC manufactured by Onsemi. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF1013_P is no longer produced by Onsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The FPF1014 is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF1014 is currently in active production through Rochester Electronics's standard distribution channels. | 6-UFBGA, WLCSP | 26.533 In Stock | $0.1712 | 1 | ACTIVE | ||
| Rochester Electronics | The FPF1015 is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-VDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF1015 is currently in active production through Rochester Electronics's standard distribution channels. | 6-VDFN Exposed Pad | 13.428 In Stock | $0.3804 | 1 | ACTIVE | ||
| Rochester Electronics | The FPF1016 is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-VDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF1016 is currently in active production through Rochester Electronics's standard distribution channels. | 6-VDFN Exposed Pad | 26.164 In Stock | $0.3328 | 1 | ACTIVE | ||
| Rochester Electronics | The FPF1016-ON is a power distribution IC manufactured by Rochester Electronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF1016-ON is currently in active production through Rochester Electronics's standard distribution channels. | Check | 2.978 In Stock | $0.9120 | 1 | ACTIVE | ||
| Rochester Electronics | The FPF1017 is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-VDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF1017 is currently in active production through Rochester Electronics's standard distribution channels. | 6-VDFN Exposed Pad | 25.658 In Stock | $0.3328 | 1 | ACTIVE | ||
| Rochester Electronics | The FPF1018 is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-VDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF1018 is currently in active production through Rochester Electronics's standard distribution channels. | 6-VDFN Exposed Pad | 16.702 In Stock | $0.2625 | 1 | ACTIVE | ||
| Onsemi | The FPF1038UCX is a power distribution IC manufactured by Onsemi. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF1038UCX is currently in active production through Onsemi's standard distribution channels. | 6-UFBGA, WLCSP | 7.200 In Stock | $0.3357 | 1 | ACTIVE | ||
| Rochester Electronics | The FPF1039BUCX is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF1039BUCX is currently in active production through Rochester Electronics's standard distribution channels. | 6-UFBGA, WLCSP | 19.360 In Stock | $0.3804 | 1 | ACTIVE | ||
| Onsemi | The FPF1048BUCX is a power distribution IC manufactured by Onsemi. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 6-UFBGA, WLCSP package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF1048BUCX is currently in active production through Onsemi's standard distribution channels. | 6-UFBGA, WLCSP | 32.400 In Stock | $0.1926 | 1 | ACTIVE | ||
| Rochester Electronics | The FPF1103 is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 4-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF1103 is currently in active production through Rochester Electronics's standard distribution channels. | 4-UFBGA, WLCSP | 10.892 In Stock | $0.2735 | 1 | ACTIVE | ||
| Rochester Electronics | The FPF1104 is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 4-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF1104 is currently in active production through Rochester Electronics's standard distribution channels. | 4-UFBGA, WLCSP | 40.578 In Stock | $0.2735 | 1 | ACTIVE |