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Component category

Power Management

FPGACenter stocks 226,180 Power Management part numbers across Torex, Texas Instruments, and Rochester. Same-day dispatch on in-stock items.

Part NumberManufacturerDescriptionPackageStockPriceMOQStatus
NXP SemiconductorsThe MC06XS4200CFKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 23-PQFN (12x12) package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XS4200CFKR2 is currently in active production through NXP Semiconductors's standard distribution channels.Check839 In Stock$22.081ACTIVE
NXP SemiconductorsThe MC06XS4200DFK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 23-PQFN (12x12) package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XS4200DFK is currently in active production through NXP Semiconductors's standard distribution channels.Check1.577 In Stock$9.981ACTIVE
NXP SemiconductorsThe MC06XS4200DFKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 23-PQFN (12x12) package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XS4200DFKR2 is currently in active production through NXP Semiconductors's standard distribution channels.Check2.273 In Stock$22.401ACTIVE
NXP SemiconductorsThe MC06XS4200FK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XS4200FK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.23-PowerQFNRFQ for sourcing$28.131OBSOLETE
NXP SemiconductorsThe MC06XS4200FKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XS4200FKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.23-PowerQFNRFQ for sourcing$28.131OBSOLETE
Rochester ElectronicsThe MC06XSD200FK is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XSD200FK is currently in active production through Rochester Electronics's standard distribution channels.23-PowerQFN2.640 In StockRFQ1ACTIVE
NXP SemiconductorsThe MC06XSD200FKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC06XSD200FKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.23-PowerQFNRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe MC07XS3200EK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XS3200EK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcing$2.881OBSOLETE
NXP SemiconductorsThe MC07XS3200EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XS3200EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcing$12.891OBSOLETE
NXP SemiconductorsThe MC07XS6517BEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XS6517BEK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.54-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe MC07XS6517BEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XS6517BEKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.54-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcing$23.781OBSOLETE
NXP SemiconductorsThe MC07XS6517DEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XS6517DEK is currently in active production through NXP Semiconductors's standard distribution channels.54-SSOP (0.295", 7.50mm Width) Exposed Pad7.207 In Stock$10.081ACTIVE
NXP SemiconductorsThe MC07XS6517DEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XS6517DEKR2 is currently in active production through NXP Semiconductors's standard distribution channels.54-SSOP (0.295", 7.50mm Width) Exposed Pad43.200 In Stock$6.561ACTIVE
NXP SemiconductorsThe MC07XS6517EK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XS6517EK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.54-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe MC07XS6517EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XS6517EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.54-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe MC07XSC200EK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSC200EK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe MC07XSC200EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSC200EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe MC07XSF517BEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSF517BEK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.54-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe MC07XSF517BEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSF517BEKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.54-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcingRFQ1OBSOLETE
Rochester ElectronicsThe MC07XSF517EK is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSF517EK is currently in active production through Rochester Electronics's standard distribution channels.54-SSOP (0.295", 7.50mm Width) Exposed Pad1.552 In Stock$4.981ACTIVE
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