Component category
Power Management
FPGACenter stocks 226,180 Power Management part numbers across Torex, Texas Instruments, and Rochester. Same-day dispatch on in-stock items.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| NXP Semiconductors | The MC07XSF517EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSF517EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $15.78 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC07XSG517DEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 54-HSOP package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSG517DEK is currently in active production through NXP Semiconductors's standard distribution channels. | Check | 1.524 In Stock | $8.62 | 1 | ACTIVE | ||
| NXP Semiconductors | The MC07XSG517DEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 54-HSOP package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSG517DEKR2 is currently in active production through NXP Semiconductors's standard distribution channels. | Check | 2.507 In Stock | $16.42 | 1 | ACTIVE | ||
| NXP Semiconductors | The MC07XSG517EK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSG517EK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $9.60 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC07XSG517EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC07XSG517EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $20.45 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC08XS6421BEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC08XS6421BEK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $12.26 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC08XS6421BEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC08XS6421BEKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC08XS6421CEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC08XS6421CEK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC08XS6421DEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC08XS6421DEK is currently in active production through NXP Semiconductors's standard distribution channels. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 1.538 In Stock | $7.05 | 1 | ACTIVE | ||
| NXP Semiconductors | The MC08XS6421DEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC08XS6421DEKR2 is currently in active production through NXP Semiconductors's standard distribution channels. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 55.320 In Stock | $3.86 | 1 | ACTIVE | ||
| Rochester Electronics | The MC08XS6421EK is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC08XS6421EK is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $4.39 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC08XS6421EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC08XS6421EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The MC08XSF421EK is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC08XSF421EK is currently in active production through Rochester Electronics's standard distribution channels. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 1.542 In Stock | $3.84 | 1 | ACTIVE | ||
| NXP Semiconductors | The MC08XSF421EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC08XSF421EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC09XS3400AFK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 24-PowerQFN package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC09XS3400AFK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-PowerQFN | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC09XS3400AFKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 24-PowerQFN package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC09XS3400AFKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-PowerQFN | RFQ for sourcing | $16.62 | 1 | OBSOLETE | ||
| Rochester Electronics | The MC10SX1130D is an LED driver IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm drive current, MOSFET or LED load compatibility, input voltage, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for motor control, LED lighting, and display backlight applications, the MC10SX1130D is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $3.60 | 1 | OBSOLETE | ||
| Rochester Electronics | The MC10SX1130DG is an LED driver IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm drive current, MOSFET or LED load compatibility, input voltage, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for motor control, LED lighting, and display backlight applications, the MC10SX1130DG is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $6.79 | 1 | OBSOLETE | ||
| Onsemi | The MC10SX1130DR2 is an LED driver IC manufactured by Onsemi. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm drive current, MOSFET or LED load compatibility, input voltage, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for motor control, LED lighting, and display backlight applications, the MC10SX1130DR2 is no longer produced by Onsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Onsemi | The MC10SX1130DR2G is an LED driver IC manufactured by Onsemi. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm drive current, MOSFET or LED load compatibility, input voltage, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for motor control, LED lighting, and display backlight applications, the MC10SX1130DR2G is no longer produced by Onsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $21.60 | 1 | OBSOLETE |