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Component category

Power Management

FPGACenter stocks 226,180 Power Management part numbers across Torex, Texas Instruments, and Rochester. Same-day dispatch on in-stock items.

Part NumberManufacturerDescriptionPackageStockPriceMOQStatus
NXP SemiconductorsThe MC15XS3400CPNAR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 24-PowerQFN package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC15XS3400CPNAR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.24-PowerQFNRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe MC15XS3400DHFK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 24-PowerQFN package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC15XS3400DHFK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.24-PowerQFNRFQ for sourcing$78.571OBSOLETE
Rochester ElectronicsThe MC15XS3400DHFKR2 is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 24-PowerQFN package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC15XS3400DHFKR2 is currently in active production through Rochester Electronics's standard distribution channels.24-PowerQFN807 In StockRFQ1ACTIVE
NXP SemiconductorsThe MC15XS3400DPNA is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 24-PowerQFN package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC15XS3400DPNA is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.24-PowerQFNRFQ for sourcing$8.731OBSOLETE
NXP SemiconductorsThe MC15XS3400DPNAR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 24-PowerQFN package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC15XS3400DPNAR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.24-PowerQFNRFQ for sourcing$12.091OBSOLETE
NXP SemiconductorsThe MC16XSD200BFK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC16XSD200BFK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.23-PowerQFNRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe MC16XSD200BFKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC16XSD200BFKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.23-PowerQFNRFQ for sourcingRFQ1OBSOLETE
Rochester ElectronicsThe MC16XSD200FK is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC16XSD200FK is currently in active production through Rochester Electronics's standard distribution channels.23-PowerQFN853 In StockRFQ1ACTIVE
NXP SemiconductorsThe MC16XSD200FKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC16XSD200FKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.23-PowerQFNRFQ for sourcing$12.361OBSOLETE
Rochester ElectronicsThe MC1723BD is an LDO voltage regulator manufactured by Rochester Electronics. Design review should confirm input voltage, output voltage, voltage threshold, LDO or supervisor behavior when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for battery-powered devices, portable electronics, and industrial sensors applications, the MC1723BD is currently in active production through Rochester Electronics's standard distribution channels.Check1.640 In Stock$0.21451ACTIVE
Rochester ElectronicsThe MC17XS6400BEK is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC17XS6400BEK is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcing$9.281OBSOLETE
NXP SemiconductorsThe MC17XS6400BEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC17XS6400BEKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe MC17XS6400CEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC17XS6400CEK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcing$19.641OBSOLETE
NXP SemiconductorsThe MC17XS6400CEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC17XS6400CEKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe MC17XS6400DEK is a power distribution IC manufactured by NXP Semiconductors, part of the Automotive, AEC-Q100 series. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 32-HSOP package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC17XS6400DEK is currently in active production through NXP Semiconductors's standard distribution channels.Check1.542 In Stock$7.881ACTIVE
NXP SemiconductorsThe MC17XS6400DEKR2 is a power distribution IC manufactured by NXP Semiconductors, part of the Automotive, AEC-Q100 series. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC17XS6400DEKR2 is currently in active production through NXP Semiconductors's standard distribution channels.32-SSOP (0.295", 7.50mm Width) Exposed Pad2.609 In Stock$12.521ACTIVE
Rochester ElectronicsThe MC17XS6400EK is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC17XS6400EK is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe MC17XS6400EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC17XS6400EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcingRFQ1OBSOLETE
Rochester ElectronicsThe MC17XS6500BEK is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC17XS6500BEK is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcingRFQ1OBSOLETE
NXP SemiconductorsThe MC17XS6500BEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC17XS6500BEKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcing$12.071OBSOLETE
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