Component category
Power Management
FPGACenter stocks 226,180 Power Management part numbers across Torex, Texas Instruments, and Rochester. Same-day dispatch on in-stock items.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Rochester Electronics | The MC20XS4200BFK is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC20XS4200BFK is currently in active production through Rochester Electronics's standard distribution channels. | 23-PowerQFN | 2.316 In Stock | RFQ | 1 | ACTIVE | ||
| NXP Semiconductors | The MC20XS4200BFKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC20XS4200BFKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 23-PowerQFN | RFQ for sourcing | $19.78 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC20XS4200DFK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 23-PQFN (12x12) package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC20XS4200DFK is currently in active production through NXP Semiconductors's standard distribution channels. | Check | 1.058 In Stock | $11.18 | 1 | ACTIVE | ||
| NXP Semiconductors | The MC20XS4200DFKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 23-PQFN (12x12) package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC20XS4200DFKR2 is currently in active production through NXP Semiconductors's standard distribution channels. | Check | 1.747 In Stock | $13.81 | 1 | ACTIVE | ||
| NXP Semiconductors | The MC20XS4200FK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC20XS4200FK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 23-PowerQFN | RFQ for sourcing | $18.91 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC20XS4200FKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 23-PowerQFN package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC20XS4200FKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 23-PowerQFN | RFQ for sourcing | $19.78 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC22XS4200BEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC22XS4200BEK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC22XS4200BEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC22XS4200BEKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $17.47 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC22XS4200CEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC22XS4200CEK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $20.54 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC22XS4200CEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC22XS4200CEKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $17.47 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC22XS4200DEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 32-HSOP package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC22XS4200DEK is currently in active production through NXP Semiconductors's standard distribution channels. | Check | 572 In Stock | $14.00 | 1 | ACTIVE | ||
| NXP Semiconductors | The MC22XS4200DEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC22XS4200DEKR2 is currently in active production through NXP Semiconductors's standard distribution channels. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 2.388 In Stock | $12.90 | 1 | ACTIVE | ||
| Rochester Electronics | The MC22XSD200BEK-NXP is a power distribution IC manufactured by Rochester Electronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC22XSD200BEK-NXP is currently in active production through Rochester Electronics's standard distribution channels. | Check | 1.070 In Stock | $15.46 | 1 | ACTIVE | ||
| NXP Semiconductors | The MC22XSD200BEKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC22XSD200BEKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $17.47 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC25XS6300BEK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC25XS6300BEK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC25XS6300EK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC25XS6300EK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $6.85 | 1 | OBSOLETE | ||
| NXP Semiconductors | The MC25XS6300EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 125°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MC25XS6300EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | RFQ for sourcing | $9.55 | 1 | OBSOLETE | ||
| Micro Commercial Components, Corp. | The MC28L05-TP is an LDO voltage regulator manufactured by Micro Commercial Components, Corp.. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, voltage threshold, LDO or supervisor behavior when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-236-3, SC-59, SOT-23-3 package and is rated for operation across -40°C ~ 85°C (TA). Designed for battery-powered devices, portable electronics, and industrial sensors applications, the MC28L05-TP is no longer produced by Micro Commercial Components, Corp.; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-236-3, SC-59, SOT-23-3 | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Micro Commercial Components, Corp. | The MC28L05F-TP is an LDO voltage regulator manufactured by Micro Commercial Components, Corp.. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, voltage threshold, LDO or supervisor behavior when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-243AA package and is rated for operation across -40°C ~ 85°C (TA). Designed for battery-powered devices, portable electronics, and industrial sensors applications, the MC28L05F-TP is no longer produced by Micro Commercial Components, Corp.; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-243AA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Mitsumi Electric | The MC3011CL1GAM is a battery management IC manufactured by Mitsumi Electric. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 4-XDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MC3011CL1GAM is currently in active production through Mitsumi Electric's standard distribution channels. | 4-XDFN Exposed Pad | 2.797 In Stock | RFQ | 1 | ACTIVE |