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Power Switches & Distribution

Find Power Switches & Distribution from Texas Instruments, ST, and additional brands. 10,863 part numbers available at FPGACenter. No MOQ, fast global shipping.

Part NumberManufacturerDescriptionPackageStockPriceMOQStatus
MCZ33879EK
NXP SemiconductorsThe MCZ33879EK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33879EK is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcing$6.161OBSOLETE
NXP SemiconductorsThe MCZ33879EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33879EKR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-SSOP (0.295", 7.50mm Width) Exposed PadRFQ for sourcing$7.811OBSOLETE
MCZ33880EG
NXP SemiconductorsThe MCZ33880EG is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 28-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33880EG is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.28-SOIC (0.295", 7.50mm Width)RFQ for sourcing$5.391OBSOLETE
Rochester ElectronicsThe MCZ33880EGR2 is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 28-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33880EGR2 is currently in active production through Rochester Electronics's standard distribution channels.28-SOIC (0.295", 7.50mm Width)824 In Stock$8.661ACTIVE
MCZ33880EW
NXP SemiconductorsThe MCZ33880EW is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-BSSOP (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33880EW is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-BSSOP (0.295", 7.50mm Width)RFQ for sourcing$7.471OBSOLETE
NXP SemiconductorsThe MCZ33880EWR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-BSSOP (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33880EWR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.32-BSSOP (0.295", 7.50mm Width)RFQ for sourcing$9.521OBSOLETE
MCZ33996EK
NXP SemiconductorsThe MCZ33996EK is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33996EK is currently in active production through NXP Semiconductors's standard distribution channels.32-SSOP (0.295", 7.50mm Width) Exposed Pad7,153 In Stock$4.871ACTIVE
NXP SemiconductorsThe MCZ33996EKR2 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33996EKR2 is currently in active production through NXP Semiconductors's standard distribution channels.32-SSOP (0.295", 7.50mm Width) Exposed Pad28,879 In Stock$8.121ACTIVE
MCZ33999EK
Rochester ElectronicsThe MCZ33999EK is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33999EK is currently in active production through Rochester Electronics's standard distribution channels.54-SSOP (0.295", 7.50mm Width) Exposed Pad5,886 In Stock$9.191ACTIVE
Rochester ElectronicsThe MCZ33999EKR2 is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 54-SSOP (0.295", 7.50mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ33999EKR2 is currently in active production through Rochester Electronics's standard distribution channels.54-SSOP (0.295", 7.50mm Width) Exposed Pad3,054 In Stock$6.301ACTIVE
NXP SemiconductorsThe MCZ34652EFR2 is a power switch IC manufactured by NXP Semiconductors. Key technical specifications include -80V ~ -15V input voltage, 900 µA quiescent current, and -40°C ~ 85°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ34652EFR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.16-SOIC (0.154", 3.90mm Width)RFQ for sourcing$3.881OBSOLETE
NXP SemiconductorsThe MCZ34653EF is a power switch IC manufactured by NXP Semiconductors. Key technical specifications include -74V ~ -39V input voltage, 900 µA quiescent current, and -40°C ~ 85°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ34653EF is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.8-SOIC (0.154", 3.90mm Width)RFQ for sourcing$6.981OBSOLETE
NXP SemiconductorsThe MCZ34653EFR2 is a power switch IC manufactured by NXP Semiconductors. Key technical specifications include -74V ~ -39V input voltage, 900 µA quiescent current, and -40°C ~ 85°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MCZ34653EFR2 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.8-SOIC (0.154", 3.90mm Width)RFQ for sourcing$12.381OBSOLETE
OnsemiThe MDC3105DMT1G is a power distribution IC manufactured by Onsemi. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in an SC-74, SOT-457 package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MDC3105DMT1G is no longer produced by Onsemi; FPGACenter maintains verified stock sourced through certified supply chain partners.SC-74, SOT-457RFQ for sourcing$0.19531OBSOLETE
MDC3105LT1
OnsemiThe MDC3105LT1 is a power distribution IC manufactured by Onsemi. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-236-3, SC-59, SOT-23-3 package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MDC3105LT1 is no longer produced by Onsemi; FPGACenter maintains verified stock sourced through certified supply chain partners.TO-236-3, SC-59, SOT-23-3RFQ for sourcing$0.69301OBSOLETE
OnsemiThe MDC3105LT1G is a power distribution IC manufactured by Onsemi. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-236-3, SC-59, SOT-23-3 package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MDC3105LT1G is currently in active production through Onsemi's standard distribution channels.TO-236-3, SC-59, SOT-23-31,227 In Stock$0.70001ACTIVE
MicrochipThe MIC1344YFT-T5 is a discrete diode manufactured by Microchip. Key technical specifications include 2.8V ~ 5.5V input voltage, 11 µA quiescent current, and -40°C ~ 125°C operating temperature; design review should also confirm input voltage, output voltage, and load current. This Surface Mount component is supplied in a 12-UFQFN Exposed Pad package and is rated for operation across -40°C ~ 125°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC1344YFT-T5 is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.12-UFQFN Exposed PadRFQ for sourcingRFQ1OBSOLETE
MicrochipThe MIC2003-0.5YM5 is a power distribution IC manufactured by Microchip. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in an SC-74A, SOT-753 package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC2003-0.5YM5 is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.SC-74A, SOT-753RFQ for sourcing$2.081OBSOLETE
MicrochipThe MIC2003-0.5YM5-TR is a power distribution IC manufactured by Microchip. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in an SC-74A, SOT-753 package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC2003-0.5YM5-TR is currently in active production through Microchip's standard distribution channels.SC-74A, SOT-7538,776 In Stock$0.44801ACTIVE
MicrochipThe MIC2003-0.5YM5TX is a power distribution IC manufactured by Microchip. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in an SC-74A, SOT-753 package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the MIC2003-0.5YM5TX is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.SC-74A, SOT-753RFQ for sourcing$2.221OBSOLETE
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