Component category
Specialized ICs
Find Specialized ICs from Rochester, Renesas, and additional brands. 12,415 part numbers available at FPGACenter. No MOQ, fast global shipping.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Texas Instruments | The DLP5500FYA is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 149-BFCPGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP5500FYA is no longer produced by Texas Instruments; FPGACenter maintains verified stock sourced through certified supply chain partners. | 149-BFCPGA Exposed Pad | RFQ for sourcing | $1200.08 | 1 | OBSOLETE | ||
| Texas Instruments | The DLP5500FYAT is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 149-BFCPGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP5500FYAT is no longer produced by Texas Instruments; FPGACenter maintains verified stock sourced through certified supply chain partners. | 149-BFCPGA Exposed Pad | RFQ for sourcing | $1068.98 | 1 | OBSOLETE | ||
| Texas Instruments | The DLP550JEFYA is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 149-BFCPGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP550JEFYA is currently in active production through Texas Instruments's standard distribution channels. | 149-BFCPGA Exposed Pad | 1.517 In Stock | $234.42 | 1 | ACTIVE | ||
| Texas Instruments | The DLP5530SAFYSQ1 is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 149-BFCPGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP5530SAFYSQ1 is currently in active production through Texas Instruments's standard distribution channels. | 149-BFCPGA Exposed Pad | 1.342 In Stock | $359.42 | 1 | ACTIVE | ||
| Texas Instruments | The DLP5531AAFYSQ1 is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 149-BFCPGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP5531AAFYSQ1 is currently in active production through Texas Instruments's standard distribution channels. | 149-BFCPGA Exposed Pad | 1.502 In Stock | $380.46 | 1 | ACTIVE | ||
| Texas Instruments | The DLP5531AFYKQ1 is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 149-BFCPGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP5531AFYKQ1 is currently in active production through Texas Instruments's standard distribution channels. | 149-BFCPGA Exposed Pad | 1.520 In Stock | $368.52 | 1 | ACTIVE | ||
| Texas Instruments | The DLP5532AFYSQ1 is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 149-BFCPGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP5532AFYSQ1 is currently in active production through Texas Instruments's standard distribution channels. | 149-BFCPGA Exposed Pad | 1.531 In Stock | $119.17 | 1 | ACTIVE | ||
| Texas Instruments | The DLP5533AAFYSQ1 is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 149-BFCPGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP5533AAFYSQ1 is currently in active production through Texas Instruments's standard distribution channels. | 149-BFCPGA Exposed Pad | 1.830 In Stock | $154.27 | 1 | ACTIVE | ||
| Texas Instruments | The DLP5534AFYKQ1 is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 149-BFCPGA Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP5534AFYKQ1 is currently in active production through Texas Instruments's standard distribution channels. | 149-BFCPGA Exposed Pad | 1.530 In Stock | $142.68 | 1 | ACTIVE | ||
| Texas Instruments | The DLP6500BFLQ is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 203-BECLGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP6500BFLQ is currently in active production through Texas Instruments's standard distribution channels. | 203-BECLGA | 2.507 In Stock | $4079.86 | 1 | ACTIVE | ||
| Texas Instruments | The DLP6500BFYE is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 350-BFCPGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP6500BFYE is currently in active production through Texas Instruments's standard distribution channels. | 350-BFCPGA | 1.524 In Stock | $758.66 | 1 | ACTIVE | ||
| Texas Instruments | The DLP6500FLQ is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 203-BECLGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP6500FLQ is no longer produced by Texas Instruments; FPGACenter maintains verified stock sourced through certified supply chain partners. | 203-BECLGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Texas Instruments | The DLP6500FYE is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 350-BFCPGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP6500FYE is no longer produced by Texas Instruments; FPGACenter maintains verified stock sourced through certified supply chain partners. | 350-BFCPGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Texas Instruments | The DLP650LEFYL is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 149-BCPGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP650LEFYL is currently in active production through Texas Instruments's standard distribution channels. | 149-BCPGA | 1.502 In Stock | $294.24 | 1 | ACTIVE | ||
| Texas Instruments | The DLP650LNIRFYL is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 149-BCPGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP650LNIRFYL is currently in active production through Texas Instruments's standard distribution channels. | 149-BCPGA | 1.103 In Stock | $5266.20 | 1 | ACTIVE | ||
| Texas Instruments | The DLP650NEFYE is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 350-BFCPGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP650NEFYE is currently in active production through Texas Instruments's standard distribution channels. | 350-BFCPGA | 1.507 In Stock | $431.38 | 1 | ACTIVE | ||
| Texas Instruments | The DLP650TEA0FYP is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 149-CPGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP650TEA0FYP is currently in active production through Texas Instruments's standard distribution channels. | 149-CPGA | 2.013 In Stock | $591.49 | 1 | ACTIVE | ||
| Texas Instruments | The DLP651NEA0FYP is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 149-CPGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP651NEA0FYP is currently in active production through Texas Instruments's standard distribution channels. | 149-CPGA | 2.953 In Stock | $470.12 | 1 | ACTIVE | ||
| Texas Instruments | The DLP660TEAAFYG is a specialized telecom IC manufactured by Texas Instruments. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 350-BFCPGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP660TEAAFYG is currently in active production through Texas Instruments's standard distribution channels. | 350-BFCPGA | 1.501 In Stock | $1695.32 | 1 | ACTIVE | ||
| Rochester Electronics | The DLP660TEFYG is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a 350-BFCPGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DLP660TEFYG is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 350-BFCPGA | RFQ for sourcing | RFQ | 1 | OBSOLETE |