Component category
Telecom & Specialized
Find Telecom & Specialized from Rochester, Microchip, and additional brands. 21,245 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Rochester Electronics | The DS3162 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3162 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | $208.84 | 1 | OBSOLETE | ||
| Rochester Electronics | The DS3163 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 400-BBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3163 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 400-BBGA | RFQ for sourcing | $124.12 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3163N is a specialized telecom IC manufactured by Maxim Integrated. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 400-BBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3163N is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 400-BBGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The DS3164 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 400-BBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3164 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 400-BBGA | RFQ for sourcing | $188.45 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3164+ is a specialized telecom IC manufactured by Maxim Integrated. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 400-BBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3164+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 400-BBGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3164N is a specialized telecom IC manufactured by Maxim Integrated. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 400-BBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3164N is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 400-BBGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3170 is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and DS3, E3 interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 100-LBGA, CSBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3170 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 100-LBGA, CSBGA | RFQ for sourcing | $105.38 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3170+ is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and DS3, E3 interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 100-LBGA, CSBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3170+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 100-LBGA, CSBGA | RFQ for sourcing | $11.70 | 1 | OBSOLETE | ||
| Rochester Electronics | The DS3170N is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and DS3, E3 interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 100-LBGA, CSBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3170N is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 100-LBGA, CSBGA | RFQ for sourcing | $751.93 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3170N+ is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and DS3, E3 interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 100-LBGA, CSBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3170N+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 100-LBGA, CSBGA | RFQ for sourcing | $12.60 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3170N+T&R is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and DS3, E3 interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 100-LBGA, CSBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3170N+T&R is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 100-LBGA, CSBGA | RFQ for sourcing | $44.62 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3171N+ is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and DS3, E3 interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 400-BBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3171N+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 400-BBGA | RFQ for sourcing | $13.50 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3172+ is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and DS3, E3 interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 400-BBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3172+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 400-BBGA | RFQ for sourcing | $7.51 | 1 | OBSOLETE | ||
| Rochester Electronics | The DS3172N+ is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and DS3, E3 interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 400-BBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3172N+ is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 400-BBGA | RFQ for sourcing | $836.19 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3173N is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and DS3, E3 interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 400-BBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3173N is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 400-BBGA | RFQ for sourcing | $8.06 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3174 is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and DS3, E3 interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 400-BBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3174 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 400-BBGA | RFQ for sourcing | $6.26 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3174+ is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and DS3, E3 interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 400-BBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3174+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 400-BBGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3174N is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and DS3, E3 interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 400-BBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3174N is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 400-BBGA | RFQ for sourcing | $13.50 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3174N+ is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and DS3, E3 interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 400-BBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3174N+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 400-BBGA | RFQ for sourcing | $15.30 | 1 | OBSOLETE | ||
| Rochester Electronics | The DS3181 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3181 is currently in active production through Rochester Electronics's standard distribution channels. | Check | 1.613 In Stock | $53.02 | 1 | ACTIVE |