Component category
Telecom & Specialized
Find Telecom & Specialized from Rochester, Microchip, and additional brands. 21,245 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| ams OSRAM | The BG; CYGNUS CONTROLLER UNIT DE is a specialized telecom IC manufactured by ams OSRAM. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BG; CYGNUS CONTROLLER UNIT DE is no longer produced by ams OSRAM; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| ams OSRAM | The BG; CYGNUS CONTROLLER UNIT ES is a specialized telecom IC manufactured by ams OSRAM. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BG; CYGNUS CONTROLLER UNIT ES is no longer produced by ams OSRAM; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| ams OSRAM | The BG; CYGNUS CONTROLLER UNIT FR is a specialized telecom IC manufactured by ams OSRAM. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BG; CYGNUS CONTROLLER UNIT FR is no longer produced by ams OSRAM; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| ams OSRAM | The BG; CYGNUS CONTROLLER UNIT JA is a specialized telecom IC manufactured by ams OSRAM. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BG; CYGNUS CONTROLLER UNIT JA is no longer produced by ams OSRAM; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| ams OSRAM | The BG; CYGNUS CONTROLLER UNIT PT is a specialized telecom IC manufactured by ams OSRAM. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BG; CYGNUS CONTROLLER UNIT PT is no longer produced by ams OSRAM; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| ams OSRAM | The BG; CYGNUS CONTROLLER UNIT RU is a specialized telecom IC manufactured by ams OSRAM. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BG; CYGNUS CONTROLLER UNIT RU is no longer produced by ams OSRAM; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| ams OSRAM | The BG; EX-IQ-BOX2 is a specialized telecom IC manufactured by ams OSRAM. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BG; EX-IQ-BOX2 is no longer produced by ams OSRAM; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| ams OSRAM | The BG; IB-EMULATOR BASIS INCL. VERPACKUNG is a specialized telecom IC manufactured by ams OSRAM. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BG; IB-EMULATOR BASIS INCL. VERPACKUNG is no longer produced by ams OSRAM; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| ams OSRAM | The BG; MED-COM IOL-MASTER CONGA is a specialized telecom IC manufactured by ams OSRAM. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BG; MED-COM IOL-MASTER CONGA is no longer produced by ams OSRAM; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| ams OSRAM | The BG; MMCS-WATERID is a specialized telecom IC manufactured by ams OSRAM. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BG; MMCS-WATERID is no longer produced by ams OSRAM; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| ams OSRAM | The BG; WATERID-TURBITITY is a specialized telecom IC manufactured by ams OSRAM. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BG; WATERID-TURBITITY is no longer produced by ams OSRAM; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The BGA2866 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGA2866 is currently in active production through Rochester Electronics's standard distribution channels. | Check | 7.037 In Stock | $0.0090 | 1 | ACTIVE | ||
| Rochester Electronics | The BGA2866115 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGA2866115 is currently in active production through Rochester Electronics's standard distribution channels. | Check | 2.566 In Stock | $0.4079 | 1 | ACTIVE | ||
| Rochester Electronics | The BGA6130118 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGA6130118 is currently in active production through Rochester Electronics's standard distribution channels. | Check | 1.053 In Stock | RFQ | 1 | ACTIVE | ||
| Rochester Electronics | The BGA6H1C6E6327XUSA1 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGA6H1C6E6327XUSA1 is currently in active production through Rochester Electronics's standard distribution channels. | Check | 819 In Stock | RFQ | 1 | ACTIVE | ||
| Infineon Technologies | The BGF 104C E6327 is a specialized telecom IC manufactured by Infineon Technologies. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 16-WFBGA, WLCSP package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGF 104C E6327 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-WFBGA, WLCSP | RFQ for sourcing | $1.03 | 1 | OBSOLETE | ||
| Infineon Technologies | The BGF104CE6328XTSA1 is a specialized telecom IC manufactured by Infineon Technologies. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 16-WFBGA, WLCSP package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGF104CE6328XTSA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-WFBGA, WLCSP | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Infineon Technologies | The BGF110E6327XT is a specialized telecom IC manufactured by Infineon Technologies. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 24-UFBGA, WLCSP package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGF110E6327XT is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-UFBGA, WLCSP | RFQ for sourcing | $1.13 | 1 | OBSOLETE | ||
| Infineon Technologies | The BGF117E6328XTSA1 is a specialized telecom IC manufactured by Infineon Technologies. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 16-UFBGA, WLCSP package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGF117E6328XTSA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-UFBGA, WLCSP | RFQ for sourcing | $0.2591 | 1 | OBSOLETE | ||
| Infineon Technologies | The BGF148E6327XTSA1 is a specialized telecom IC manufactured by Infineon Technologies. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 14-XFQFN Exposed Pad package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGF148E6327XTSA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 14-XFQFN Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE |