| RT4G150-1CBG1657PROTO | FPGAs | The RT4G150-1CBG1657PROTO is an FPGA manufactured by Microsemi, part of the RTG4™ series. Key technical specifications include 151824 logic elements, 1.14V ~ 1.26V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1657-BCBGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1CBG1657PROTO is currently in active production through Microsemi's standard distribution channels. | 1657-BCBGA | 614 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-1CGG1657B | FPGAs | The RT4G150-1CGG1657B is an FPGA manufactured by Microsemi, part of the RTG4™ series. Key technical specifications include 151824 logic elements, 1.14V ~ 1.26V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1657-BFCCGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1CGG1657B is currently in active production through Microsemi's standard distribution channels. | 1657-BFCCGA | 2.811 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-1CGG1657E | FPGAs | The RT4G150-1CGG1657E is an FPGA manufactured by Microsemi, part of the RTG4™ series. Key technical specifications include 151824 logic elements, 1.14V ~ 1.26V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1657-BFCCGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1CGG1657E is currently in active production through Microsemi's standard distribution channels. | 1657-BFCCGA | 1.968 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-1CGG1657M | FPGAs | The RT4G150-1CGG1657M is an FPGA manufactured by Microsemi, part of the RTG4™ series. Key technical specifications include 151824 logic elements, 1.14V ~ 1.26V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1657-BFCCGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1CGG1657M is currently in active production through Microsemi's standard distribution channels. | 1657-BFCCGA | 1.543 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-1CGG1657PROTO | FPGAs | The RT4G150-1CGG1657PROTO is an FPGA manufactured by Microsemi, part of the RTG4™ series. Key technical specifications include 151824 logic elements, 1.14V ~ 1.26V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1657-BFCCGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1CGG1657PROTO is currently in active production through Microsemi's standard distribution channels. | 1657-BFCCGA | 1.871 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-1CGG1657R | FPGAs | The RT4G150-1CGG1657R is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a standard package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1CGG1657R is currently in active production through Microsemi's standard distribution channels. | — | 1.679 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-1CGG1657V | FPGAs | The RT4G150-1CGG1657V is an FPGA manufactured by Microsemi, part of the RTG4™ series. Key technical specifications include 151824 logic elements, 1.14V ~ 1.26V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1657-BFCCGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1CGG1657V is currently in active production through Microsemi's standard distribution channels. | 1657-BFCCGA | 10 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-1CQG352B | FPGAs | The RT4G150-1CQG352B is an FPGA manufactured by Microsemi, part of the RTG4™ series. Key technical specifications include 151824 logic elements, 1.14V ~ 1.26V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 352-BFCQFP Exposed Pad package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1CQG352B is currently in active production through Microsemi's standard distribution channels. | 352-BFCQFP Exposed Pad | 2.181 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-1CQG352E | FPGAs | The RT4G150-1CQG352E is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 352-BFCQFP Exposed Pad package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1CQG352E is currently in active production through Microsemi's standard distribution channels. | 352-BFCQFP Exposed Pad | 10 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-1CQG352M | FPGAs | The RT4G150-1CQG352M is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 352-BFCQFP Exposed Pad package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1CQG352M is currently in active production through Microsemi's standard distribution channels. | 352-BFCQFP Exposed Pad | 10 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-1CQG352PROTO | FPGAs | The RT4G150-1CQG352PROTO is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 352-BFCQFP Exposed Pad package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1CQG352PROTO is currently in active production through Microsemi's standard distribution channels. | 352-BFCQFP Exposed Pad | 2.476 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-1CQG352R | FPGAs | The RT4G150-1CQG352R is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 352-BFCQFP Exposed Pad package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1CQG352R is currently in active production through Microsemi's standard distribution channels. | 352-BFCQFP Exposed Pad | 10 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-1CQG352V | FPGAs | The RT4G150-1CQG352V is an FPGA manufactured by Microsemi, part of the RTG4™ series. Key technical specifications include 151824 logic elements, 1.14V ~ 1.26V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 352-BFCQFP Exposed Pad package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1CQG352V is currently in active production through Microsemi's standard distribution channels. | 352-BFCQFP Exposed Pad | 1.332 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-1LGG1657B | FPGAs | The RT4G150-1LGG1657B is an FPGA manufactured by Microsemi, part of the RTG4™ series. Key technical specifications include 151824 logic elements, 1.14V ~ 1.26V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1657-BCLGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1LGG1657B is currently in active production through Microsemi's standard distribution channels. | 1657-BCLGA | 10 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-1LGG1657E | FPGAs | The RT4G150-1LGG1657E is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 1657-BCLGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1LGG1657E is currently in active production through Microsemi's standard distribution channels. | 1657-BCLGA | 2.974 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-1LGG1657M | FPGAs | The RT4G150-1LGG1657M is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 1657-BCLGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1LGG1657M is currently in active production through Microsemi's standard distribution channels. | 1657-BCLGA | 10 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-1LGG1657PROTO | FPGAs | The RT4G150-1LGG1657PROTO is an FPGA manufactured by Microsemi, part of the RTG4™ series. Key technical specifications include 151824 logic elements, 1.14V ~ 1.26V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1657-BCLGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1LGG1657PROTO is currently in active production through Microsemi's standard distribution channels. | 1657-BCLGA | 2.275 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-1LGG1657R | FPGAs | The RT4G150-1LGG1657R is an FPGA manufactured by Microsemi, part of the RTG4™ series. Key technical specifications include 151824 logic elements, 1.14V ~ 1.26V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1657-BCLGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1LGG1657R is currently in active production through Microsemi's standard distribution channels. | 1657-BCLGA | 10 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-1LGG1657V | FPGAs | The RT4G150-1LGG1657V is an FPGA manufactured by Microsemi, part of the RTG4™ series. Key technical specifications include 151824 logic elements, 1.14V ~ 1.26V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1657-BCLGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-1LGG1657V is currently in active production through Microsemi's standard distribution channels. | 1657-BCLGA | 10 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-CBG1657PROTO | FPGAs | The RT4G150-CBG1657PROTO is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 1657-BCBGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-CBG1657PROTO is currently in active production through Microsemi's standard distribution channels. | 1657-BCBGA | 2.275 In Stock | RFQ | ACTIVE | RFQ |