| RT4G150-CGG1657B | FPGAs | The RT4G150-CGG1657B is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a standard package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-CGG1657B is currently in active production through Microsemi's standard distribution channels. | — | 1.107 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-CGG1657E | FPGAs | The RT4G150-CGG1657E is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a standard package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-CGG1657E is currently in active production through Microsemi's standard distribution channels. | — | 1.407 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-CGG1657M | FPGAs | The RT4G150-CGG1657M is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a standard package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-CGG1657M is currently in active production through Microsemi's standard distribution channels. | — | 2.004 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-CGG1657PROTO | FPGAs | The RT4G150-CGG1657PROTO is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a standard package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-CGG1657PROTO is currently in active production through Microsemi's standard distribution channels. | — | 1.861 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-CGG1657R | FPGAs | The RT4G150-CGG1657R is an FPGA manufactured by Microsemi, part of the RTG4™ series. Key technical specifications include 151824 logic elements, 1.14V ~ 1.26V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1657-BFCCGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-CGG1657R is currently in active production through Microsemi's standard distribution channels. | 1657-BFCCGA | 10 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-CGG1657V | FPGAs | The RT4G150-CGG1657V is an FPGA manufactured by Microsemi, part of the RTG4™ series. Key technical specifications include 151824 logic elements, 1.14V ~ 1.26V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1657-BFCCGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-CGG1657V is currently in active production through Microsemi's standard distribution channels. | 1657-BFCCGA | 649 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-CQG352B | FPGAs | The RT4G150-CQG352B is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 352-BFCQFP Exposed Pad package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-CQG352B is currently in active production through Microsemi's standard distribution channels. | 352-BFCQFP Exposed Pad | 10 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-CQG352E | FPGAs | The RT4G150-CQG352E is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 352-BFCQFP Exposed Pad package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-CQG352E is currently in active production through Microsemi's standard distribution channels. | 352-BFCQFP Exposed Pad | 10 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-CQG352M | FPGAs | The RT4G150-CQG352M is an FPGA manufactured by Microsemi, part of the RTG4™ series. Key technical specifications include 151824 logic elements, 1.14V ~ 1.26V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 352-BFCQFP Exposed Pad package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-CQG352M is currently in active production through Microsemi's standard distribution channels. | 352-BFCQFP Exposed Pad | 2.328 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-CQG352PROTO | FPGAs | The RT4G150-CQG352PROTO is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 352-BFCQFP Exposed Pad package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-CQG352PROTO is currently in active production through Microsemi's standard distribution channels. | 352-BFCQFP Exposed Pad | 10 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-CQG352R | FPGAs | The RT4G150-CQG352R is an FPGA manufactured by Microsemi, part of the RTG4™ series. Key technical specifications include 151824 logic elements, 1.14V ~ 1.26V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 352-BFCQFP Exposed Pad package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-CQG352R is currently in active production through Microsemi's standard distribution channels. | 352-BFCQFP Exposed Pad | 10 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-CQG352V | FPGAs | The RT4G150-CQG352V is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 352-BFCQFP Exposed Pad package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-CQG352V is currently in active production through Microsemi's standard distribution channels. | 352-BFCQFP Exposed Pad | 1.902 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-LGG1657B | FPGAs | The RT4G150-LGG1657B is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 1657-BCLGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-LGG1657B is currently in active production through Microsemi's standard distribution channels. | 1657-BCLGA | 1.783 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-LGG1657E | FPGAs | The RT4G150-LGG1657E is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 1657-BCLGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-LGG1657E is currently in active production through Microsemi's standard distribution channels. | 1657-BCLGA | 2.405 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-LGG1657M | FPGAs | The RT4G150-LGG1657M is an FPGA manufactured by Microsemi, part of the RTG4™ series. Key technical specifications include 151824 logic elements, 1.14V ~ 1.26V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1657-BCLGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-LGG1657M is currently in active production through Microsemi's standard distribution channels. | 1657-BCLGA | 10 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-LGG1657PROTO | FPGAs | The RT4G150-LGG1657PROTO is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 1657-BCLGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-LGG1657PROTO is currently in active production through Microsemi's standard distribution channels. | 1657-BCLGA | 1.581 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150-LGG1657R | FPGAs | The RT4G150-LGG1657R is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 1657-BCLGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150-LGG1657R is currently in active production through Microsemi's standard distribution channels. | 1657-BCLGA | 1.384 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150L-CBG1657PROTO | FPGAs | The RT4G150L-CBG1657PROTO is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 1657-BCBGA package and is rated for operation across -55°C ~ 125°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150L-CBG1657PROTO is currently in active production through Microsemi's standard distribution channels. | 1657-BCBGA | 1.048 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150L-CGG1657B | FPGAs | The RT4G150L-CGG1657B is an FPGA manufactured by Microsemi, part of the RTG4™ series. Technical highlights include -55°C ~ 125°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a standard package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150L-CGG1657B is currently in active production through Microsemi's standard distribution channels. | — | 10 In Stock | RFQ | ACTIVE | RFQ |
| RT4G150L-CGG1657E | FPGAs | The RT4G150L-CGG1657E is an FPGA manufactured by Microsemi, part of the RTG4™ series. Key technical specifications include 151824 logic elements, 1.14V ~ 1.26V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1657-BFCCGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the RT4G150L-CGG1657E is currently in active production through Microsemi's standard distribution channels. | 1657-BFCCGA | 1.503 In Stock | RFQ | ACTIVE | RFQ |