Find Power Distribution Switches from ST, Texas Instruments, and additional brands. 6,768 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
The TBD62003AFWG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62003AFWG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62003APG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 16-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62003APG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62004AFG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62004AFG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62004AFNG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62004AFNG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62004AFWG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62004AFWG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62004APG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 16-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62004APG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62064AFG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-BSOP (0.252", 6.40mm Width) + 2 Heat Tabs package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62064AFG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62064APG,HZ is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 16-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62064APG,HZ is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62083AFG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.276", 7.00mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62083AFG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62083AFWG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62083AFWG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62083APG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 18-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62083APG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62084AFG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.276", 7.00mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62084AFG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62084AFNG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62084AFNG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62084AFWG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62084AFWG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62084APG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 18-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62084APG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62089APG is a power distribution IC manufactured by Toshiba. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 20-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62089APG is currently in active production through Toshiba's standard distribution channels.
The TBD62183AFNG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62183AFNG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62183AFWG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62183AFWG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62308AFAG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 24-SOP (0.236", 6.00mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62308AFAG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62308AFG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-BSOP (0.252", 6.40mm Width) + 2 Heat Tabs package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62308AFG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.