Find Power Distribution Switches from ST, Texas Instruments, and additional brands. 6,768 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
The TBD62308APG,HZ is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 16-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62308APG,HZ is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62381AFNG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62381AFNG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62381AFWG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62381AFWG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62381APG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 18-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62381APG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62384AFWG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62384AFWG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62384APG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 18-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62384APG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62387AFNG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 20-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62387AFNG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62387APG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 20-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62387APG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62502AFG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62502AFG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62502AFNG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62502AFNG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62502AFWG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62502AFWG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62502APG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 16-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62502APG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62503AFG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62503AFG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62503AFNG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62503AFNG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62503AFWG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62503AFWG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62503APG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 16-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62503APG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62781AFWG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62781AFWG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62783AFG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.276", 7.00mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62783AFG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62783AFG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.276", 7.00mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62783AFG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.
The TBD62783AFNG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62783AFNG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels.