Component category
Power Distribution Switches
Find Power Distribution Switches from ST, Texas Instruments, and additional brands. 6,768 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Toshiba Semiconductor and Storage | The TCK22975G,LF is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TCK22975G,LF is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 6-UFBGA, WLCSP | 13,272 In Stock | $0.3690 | 1 | ACTIVE | ||
| Toshiba Semiconductor and Storage | The TCK301G,LF is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 9-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TCK301G,LF is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 9-UFBGA, WLCSP | 3,243 In Stock | $1.67 | 1 | ACTIVE | ||
| Toshiba Semiconductor and Storage | The TCK302G,LF is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 9-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TCK302G,LF is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 9-UFBGA, WLCSP | 703 In Stock | $3.62 | 1 | ACTIVE | ||
| Toshiba | The TCK303G,LF is a power distribution IC manufactured by Toshiba, part of the TCK30 series. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 9-WCSP (1.5x1.5) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TCK303G,LF is currently in active production through Toshiba's standard distribution channels. | Check | 1,741 In Stock | $1.05 | 1 | ACTIVE | ||
| Toshiba Semiconductor and Storage | The TCK305G,LF is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 9-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TCK305G,LF is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 9-UFBGA, WLCSP | 2,092 In Stock | $3.62 | 1 | ACTIVE | ||
| Toshiba Semiconductor and Storage | The TCK321G,LF is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-UFBGA, CSPBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TCK321G,LF is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 16-UFBGA, CSPBGA | 15,000 In Stock | $1.13 | 1 | ACTIVE | ||
| Toshiba Semiconductor and Storage | The TCK322G,LF is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-UFBGA, CSPBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TCK322G,LF is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 16-UFBGA, CSPBGA | 11,937 In Stock | $1.94 | 1 | ACTIVE | ||
| Toshiba Semiconductor and Storage | The TCK323G,LF is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-UFBGA, CSPBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TCK323G,LF is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 16-UFBGA, CSPBGA | 17,322 In Stock | $0.8910 | 1 | ACTIVE | ||
| STMicroelectronics | The TDE1707BFP is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1707BFP is currently in active production through STMicroelectronics's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 34,246 In Stock | $3.44 | 1 | ACTIVE | ||
| STMicroelectronics | The TDE1707BFPT is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1707BFPT is currently in active production through STMicroelectronics's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 20,087 In Stock | $3.91 | 1 | ACTIVE | ||
| STMicroelectronics | The TDE1707CFP is a power distribution IC manufactured by STMicroelectronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1707CFP is currently in active production through STMicroelectronics's standard distribution channels. | Check | 2,309 In Stock | $7.98 | 1 | ACTIVE | ||
| STMicroelectronics | The TDE1707CFPT is a power distribution IC manufactured by STMicroelectronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1707CFPT is currently in active production through STMicroelectronics's standard distribution channels. | Check | 2,037 In Stock | $7.98 | 1 | ACTIVE | ||
| STMicroelectronics | The TDE1707DFT is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-VDFN Exposed Pad package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1707DFT is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-VDFN Exposed Pad | RFQ for sourcing | $7.74 | 1 | OBSOLETE | ||
| STMicroelectronics | The TDE1708DFT is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-VDFN Exposed Pad package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1708DFT is currently in active production through STMicroelectronics's standard distribution channels. | 8-VDFN Exposed Pad | 11,882 In Stock | $3.81 | 1 | ACTIVE | ||
| STMicroelectronics | The TDE1737DP is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1737DP is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $8.13 | 1 | OBSOLETE | ||
| STMicroelectronics | The TDE1737FPT is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1737FPT is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 14-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $10.34 | 1 | OBSOLETE | ||
| STMicroelectronics | The TDE1747DP is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1747DP is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $8.27 | 1 | OBSOLETE | ||
| STMicroelectronics | The TDE1747FP is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1747FP is currently in active production through STMicroelectronics's standard distribution channels. | 14-SOIC (0.154", 3.90mm Width) | 4,836 In Stock | $2.70 | 1 | ACTIVE | ||
| STMicroelectronics | The TDE1747FPT is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1747FPT is currently in active production through STMicroelectronics's standard distribution channels. | 14-SOIC (0.154", 3.90mm Width) | 12,000 In Stock | $5.72 | 1 | ACTIVE | ||
| STMicroelectronics | The TDE1767ADP is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1767ADP is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $15.56 | 1 | OBSOLETE |