Component category
Power Distribution Switches
Find Power Distribution Switches from ST, Texas Instruments, and additional brands. 6,768 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| STMicroelectronics | The TDE1767DP is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1767DP is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $13.14 | 1 | OBSOLETE | ||
| STMicroelectronics | The TDE1787ADP is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1787ADP is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $14.87 | 1 | OBSOLETE | ||
| STMicroelectronics | The TDE1787DP is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1787DP is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $11.39 | 1 | OBSOLETE | ||
| STMicroelectronics | The TDE1798DP is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1798DP is currently in active production through STMicroelectronics's standard distribution channels. | 8-DIP (0.300", 7.62mm) | 12.000 In Stock | $3.62 | 1 | ACTIVE | ||
| STMicroelectronics | The TDE1897CDP is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1897CDP is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $11.39 | 1 | OBSOLETE | ||
| STMicroelectronics | The TDE1897RDP is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1897RDP is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $7.79 | 1 | OBSOLETE | ||
| STMicroelectronics | The TDE1897RFP is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 20-SOIC (0.295", 7.50mm Width) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1897RFP is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $7.46 | 1 | OBSOLETE | ||
| STMicroelectronics | The TDE1897RFPT is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 20-SOIC (0.295", 7.50mm Width) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1897RFPT is currently in active production through STMicroelectronics's standard distribution channels. | 20-SOIC (0.295", 7.50mm Width) | 5.694 In Stock | $5.32 | 1 | ACTIVE | ||
| STMicroelectronics | The TDE1898CDP is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1898CDP is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $12.58 | 1 | OBSOLETE | ||
| STMicroelectronics | The TDE1898CFP is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 20-SOIC (0.295", 7.50mm Width) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1898CFP is currently in active production through STMicroelectronics's standard distribution channels. | 20-SOIC (0.295", 7.50mm Width) | 3.888 In Stock | $8.41 | 1 | ACTIVE | ||
| STMicroelectronics | The TDE1898CFPT is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 20-SOIC (0.295", 7.50mm Width) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1898CFPT is currently in active production through STMicroelectronics's standard distribution channels. | 20-SOIC (0.295", 7.50mm Width) | 7.950 In Stock | $6.01 | 1 | ACTIVE | ||
| STMicroelectronics | The TDE1898RDP is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1898RDP is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $7.71 | 1 | OBSOLETE | ||
| STMicroelectronics | The TDE1898RFPT is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 20-SOIC (0.295", 7.50mm Width) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE1898RFPT is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $10.07 | 1 | OBSOLETE | ||
| STMicroelectronics | The TDE3247FP is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE3247FP is currently in active production through STMicroelectronics's standard distribution channels. | 14-SOIC (0.154", 3.90mm Width) | 4.278 In Stock | $5.99 | 1 | ACTIVE | ||
| STMicroelectronics | The TDE3247FPT is a power distribution IC manufactured by STMicroelectronics. Technical highlights include -25°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) package and is rated for operation across -25°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TDE3247FPT is currently in active production through STMicroelectronics's standard distribution channels. | 14-SOIC (0.154", 3.90mm Width) | 7.407 In Stock | $1.99 | 1 | ACTIVE | ||
| NXP Semiconductors | The TJA1010T/N1,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 135°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 28-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 135°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TJA1010T/N1,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The TLE4226G is a power distribution IC manufactured by Rochester Electronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TLE4226G is currently in active production through Rochester Electronics's standard distribution channels. | Check | 4.290 In Stock | $1.29 | 1 | ACTIVE | ||
| Infineon Technologies | The TLE4226GNUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 24-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TLE4226GNUMA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The TLE4247EL40 is a power distribution IC manufactured by Rochester Electronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TLE4247EL40 is currently in active production through Rochester Electronics's standard distribution channels. | Check | 23.088 In Stock | $0.7020 | 1 | ACTIVE | ||
| Infineon Technologies | The TLE4247EL40XUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TLE4247EL40XUMA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) Exposed Pad | RFQ for sourcing | $0.7594 | 1 | OBSOLETE |