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Component category

Telecom & Specialized

Find Telecom & Specialized from Rochester, Microchip, and additional brands. 21,245 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.

Part NumberManufacturerDescriptionPackageStockPriceMOQStatus
ROHM SemiconductorThe BD9355MWV-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9355MWV-E2 is currently in active production through ROHM Semiconductor's standard distribution channels.Check2.150 In Stock$6.611ACTIVE
ROHM SemiconductorThe BD9400BFP-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 7V ~ 26V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 25-SOP (0.213", 5.40mm Width) + 2 Heat Tabs package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9400BFP-E2 is currently in active production through ROHM Semiconductor's standard distribution channels.25-SOP (0.213", 5.40mm Width) + 2 Heat Tabs2.300 In StockRFQ1ACTIVE
ROHM SemiconductorThe BD9532EKN-E2 is a specialized telecom IC manufactured by ROHM Semiconductor, part of the H³Reg™ series. Technical highlights include -10°C ~ 100°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This standard mount component is supplied in a 20-VFQFN Exposed Pad package and is rated for operation across -10°C ~ 100°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9532EKN-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.20-VFQFN Exposed PadRFQ for sourcingRFQ1OBSOLETE
ROHM SemiconductorThe BD9533EKN-E2 is a specialized telecom IC manufactured by ROHM Semiconductor, part of the H³Reg™ series. Technical highlights include -10°C ~ 100°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This standard mount component is supplied in a 20-VFQFN Exposed Pad package and is rated for operation across -10°C ~ 100°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9533EKN-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.20-VFQFN Exposed PadRFQ for sourcing$6.211OBSOLETE
ROHM SemiconductorThe BD9535MUV-E2 is a specialized telecom IC manufactured by ROHM Semiconductor, part of the H³® series. Technical highlights include -10°C ~ 100°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This standard mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -10°C ~ 100°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9535MUV-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.32-VFQFN Exposed PadRFQ for sourcing$1.561OBSOLETE
ROHM SemiconductorThe BD9639MWV-BZE2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 2.5V ~ 5.5V supply voltage and -20°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 56-VFQFN Exposed Pad package and is rated for operation across -20°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9639MWV-BZE2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.56-VFQFN Exposed PadRFQ for sourcingRFQ1OBSOLETE
ROHM SemiconductorThe BD9639MWV-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9639MWV-E2 is currently in active production through ROHM Semiconductor's standard distribution channels.Check4.227 In Stock$3.101ACTIVE
ROHM SemiconductorThe BD9739KN-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 1.5V ~ 10V supply voltage and -25°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 64-VFQFN package and is rated for operation across -25°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9739KN-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.64-VFQFNRFQ for sourcing$17.101OBSOLETE
ROHM SemiconductorThe BD9745EKN-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include -25°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This standard mount component is supplied in a 48-VFQFN Exposed Pad package and is rated for operation across -25°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9745EKN-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.48-VFQFN Exposed PadRFQ for sourcing$1.681OBSOLETE
ROHM SemiconductorThe BD9749MWV-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include -25°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This standard mount component is supplied in a standard package and is rated for operation across -25°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9749MWV-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.CheckRFQ for sourcingRFQ1OBSOLETE
ROHM SemiconductorThe BD9866GUL-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 4V ~ 14V supply voltage and -25°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 48-UFBGA, CSPBGA package and is rated for operation across -25°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BD9866GUL-E2 is currently in active production through ROHM Semiconductor's standard distribution channels.48-UFBGA, CSPBGA1.600 In Stock$2.831ACTIVE
Rochester ElectronicsThe BF824235 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BF824235 is currently in active production through Rochester Electronics's standard distribution channels.Check1.247 In Stock$0.20401ACTIVE
Rochester ElectronicsThe BF840235 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BF840235 is currently in active production through Rochester Electronics's standard distribution channels.Check1.167 In Stock$0.39361ACTIVE
Rochester ElectronicsThe BF904215 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BF904215 is currently in active production through Rochester Electronics's standard distribution channels.Check2.470 In StockRFQ1ACTIVE
Rochester ElectronicsThe BFS20W115 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BFS20W115 is currently in active production through Rochester Electronics's standard distribution channels.Check2.654 In StockRFQ1ACTIVE
Rochester ElectronicsThe BFU530W115 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BFU530W115 is currently in active production through Rochester Electronics's standard distribution channels.Check5.427 In Stock$0.22461ACTIVE
Rochester ElectronicsThe BFU668F115 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BFU668F115 is currently in active production through Rochester Electronics's standard distribution channels.Check2.676 In StockRFQ1ACTIVE
Rochester ElectronicsThe BFU768F115 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BFU768F115 is currently in active production through Rochester Electronics's standard distribution channels.Check1.201 In Stock$0.53911ACTIVE
ams OSRAMThe BG CZ; RT-PC 2013 PREMIUM AEZ032142-652 is a specialized telecom IC manufactured by ams OSRAM. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BG CZ; RT-PC 2013 PREMIUM AEZ032142-652 is no longer produced by ams OSRAM; FPGACenter maintains verified stock sourced through certified supply chain partners.CheckRFQ for sourcingRFQ1OBSOLETE
ams OSRAMThe BG; BESTCKT REAR I/O KARTE is a specialized telecom IC manufactured by ams OSRAM. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BG; BESTCKT REAR I/O KARTE is no longer produced by ams OSRAM; FPGACenter maintains verified stock sourced through certified supply chain partners.CheckRFQ for sourcingRFQ1OBSOLETE
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