Hard-to-find, EOL, and shortage parts24h target RFQ responseInspection, traceability, and alternate sourcing
Component category

Telecom & Specialized

Find Telecom & Specialized from Rochester, Microchip, and additional brands. 21,245 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.

Part NumberManufacturerDescriptionPackageStockPriceMOQStatus
Rochester ElectronicsThe BGS15MC17-2E6433XUSA1 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGS15MC17-2E6433XUSA1 is currently in active production through Rochester Electronics's standard distribution channels.Check21.365 In Stock$0.33281ACTIVE
Rochester ElectronicsThe BGS1711MC222EE6433XUSA1 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGS1711MC222EE6433XUSA1 is currently in active production through Rochester Electronics's standard distribution channels.Check29.409 In Stock$0.02411ACTIVE
Rochester ElectronicsThe BGS17MC222IE6433XUSA1 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGS17MC222IE6433XUSA1 is currently in active production through Rochester Electronics's standard distribution channels.Check2.759 In StockRFQ1ACTIVE
Rochester ElectronicsThe BGS22WL10E6327XTSA1020 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGS22WL10E6327XTSA1020 is currently in active production through Rochester Electronics's standard distribution channels.Check1.505 In Stock$0.63001ACTIVE
Rochester ElectronicsThe BGS312MC27-2IE6433XUSA1 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGS312MC27-2IE6433XUSA1 is currently in active production through Rochester Electronics's standard distribution channels.Check16.280 In Stock$0.60971ACTIVE
Rochester ElectronicsThe BGS312MC272IE6433XUSA1 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGS312MC272IE6433XUSA1 is currently in active production through Rochester Electronics's standard distribution channels.Check1.989 In StockRFQ1ACTIVE
Infineon TechnologiesThe BGT60E6327XTSA1 is a specialized telecom IC manufactured by Infineon Technologies. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 119-WFBGA, WLBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGT60E6327XTSA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners.119-WFBGA, WLBGARFQ for sourcing$49.731OBSOLETE
Rochester ElectronicsThe BGU7004 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGU7004 is currently in active production through Rochester Electronics's standard distribution channels.Check864 In StockRFQ1ACTIVE
Rochester ElectronicsThe BGU7007 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGU7007 is currently in active production through Rochester Electronics's standard distribution channels.Check1.929 In StockRFQ1ACTIVE
Rochester ElectronicsThe BGU7045115 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGU7045115 is currently in active production through Rochester Electronics's standard distribution channels.Check2.767 In StockRFQ1ACTIVE
Rochester ElectronicsThe BGU7051118 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGU7051118 is currently in active production through Rochester Electronics's standard distribution channels.Check880 In StockRFQ1ACTIVE
Rochester ElectronicsThe BGU8009115 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGU8009115 is currently in active production through Rochester Electronics's standard distribution channels.Check1.703 In StockRFQ1ACTIVE
Rochester ElectronicsThe BGX7100HN1118 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGX7100HN1118 is currently in active production through Rochester Electronics's standard distribution channels.Check21.078 In Stock$0.90001ACTIVE
Rochester ElectronicsThe BGX7101HN/1118 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGX7101HN/1118 is currently in active production through Rochester Electronics's standard distribution channels.Check12.771 In Stock$2.571ACTIVE
ROHM SemiconductorThe BH6111FV-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include -15°C ~ 60°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This standard mount component is supplied in a 20-LSSOP (0.173, 4.40mm Width) package and is rated for operation across -15°C ~ 60°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BH6111FV-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.20-LSSOP (0.173, 4.40mm Width)RFQ for sourcing$5.401OBSOLETE
Rochester ElectronicsThe BHN3306D3 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BHN3306D3 is currently in active production through Rochester Electronics's standard distribution channels.Check1.940 In StockRFQ1ACTIVE
Rochester ElectronicsThe BLF202 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BLF202 is currently in active production through Rochester Electronics's standard distribution channels.Check4.500 In Stock$36.561ACTIVE
Rochester ElectronicsThe BLM7G1822S-20PB518 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BLM7G1822S-20PB518 is currently in active production through Rochester Electronics's standard distribution channels.Check3.564 In Stock$22.081ACTIVE
ROHM SemiconductorThe BP5302A is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 0°C ~ 60°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 9-SIP, 7 Leads package and is rated for operation across 0°C ~ 60°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BP5302A is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.9-SIP, 7 LeadsRFQ for sourcingRFQ1OBSOLETE
ROHM SemiconductorThe BP5302XA is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 0°C ~ 60°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 9-SIP, 7 Leads, Formed Leads package and is rated for operation across 0°C ~ 60°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BP5302XA is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners.9-SIP, 7 Leads, Formed LeadsRFQ for sourcingRFQ1OBSOLETE
Get Quote