| TBD62381AFNG,EL | Power Distribution Switches | The TBD62381AFNG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62381AFNG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 18-LSSOP (0.173", 4.40mm Width) | 10.366 In Stock | $1.18 | ACTIVE | RFQ |
| TBD62381AFWG,EL | Power Distribution Switches | The TBD62381AFWG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62381AFWG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 18-SOIC (0.295", 7.50mm Width) | 7.200 In Stock | $0.7326 | ACTIVE | RFQ |
| TBD62381APG | Power Distribution Switches | The TBD62381APG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 18-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62381APG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 18-DIP (0.300", 7.62mm) | 5.178 In Stock | $3.65 | ACTIVE | RFQ |
| TBD62384AFWG,EL | Power Distribution Switches | The TBD62384AFWG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62384AFWG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 18-SOIC (0.295", 7.50mm Width) | 13.260 In Stock | $3.02 | ACTIVE | RFQ |
| TBD62384APG | Power Distribution Switches | The TBD62384APG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 18-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62384APG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 18-DIP (0.300", 7.62mm) | 4.200 In Stock | $3.59 | ACTIVE | RFQ |
| TBD62387AFNG,EL | Power Distribution Switches | The TBD62387AFNG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 20-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62387AFNG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 20-LSSOP (0.173", 4.40mm Width) | 9.370 In Stock | $1.52 | ACTIVE | RFQ |
| TBD62387APG | Power Distribution Switches | The TBD62387APG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 20-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62387APG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 20-DIP (0.300", 7.62mm) | 1.714 In Stock | $2.29 | ACTIVE | RFQ |
| TBD62502AFG,EL | Power Distribution Switches | The TBD62502AFG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62502AFG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 16-SOIC (0.173", 4.40mm Width) | 9.072 In Stock | $0.4932 | ACTIVE | RFQ |
| TBD62502AFNG,EL | Power Distribution Switches | The TBD62502AFNG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62502AFNG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 16-LSSOP (0.173", 4.40mm Width) | 30.864 In Stock | $0.6066 | ACTIVE | RFQ |
| TBD62502AFWG,EL | Power Distribution Switches | The TBD62502AFWG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62502AFWG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 16-SOIC (0.154", 3.90mm Width) | 535 In Stock | $2.82 | ACTIVE | RFQ |
| TBD62502APG | Power Distribution Switches | The TBD62502APG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 16-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62502APG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 16-DIP (0.300", 7.62mm) | 3.879 In Stock | $1.76 | ACTIVE | RFQ |
| TBD62503AFG,EL | Power Distribution Switches | The TBD62503AFG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62503AFG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 16-SOIC (0.173", 4.40mm Width) | 55.897 In Stock | $1.92 | ACTIVE | RFQ |
| TBD62503AFNG,EL | Power Distribution Switches | The TBD62503AFNG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62503AFNG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 16-LSSOP (0.173", 4.40mm Width) | 22.211 In Stock | $1.42 | ACTIVE | RFQ |
| TBD62503AFWG,EL | Power Distribution Switches | The TBD62503AFWG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62503AFWG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 16-SOIC (0.154", 3.90mm Width) | 36.251 In Stock | $0.8280 | ACTIVE | RFQ |
| TBD62503APG | Power Distribution Switches | The TBD62503APG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a 16-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62503APG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 16-DIP (0.300", 7.62mm) | 7.200 In Stock | $0.4003 | ACTIVE | RFQ |
| TBD62781AFWG,EL | Power Distribution Switches | The TBD62781AFWG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62781AFWG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 18-SOIC (0.295", 7.50mm Width) | 11.027 In Stock | $3.19 | ACTIVE | RFQ |
| TBD62783AFG | Power Distribution Switches | The TBD62783AFG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.276", 7.00mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62783AFG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 18-SOIC (0.276", 7.00mm Width) | 37.669 In Stock | $0.4487 | ACTIVE | RFQ |
| TBD62783AFG,EL | Power Distribution Switches | The TBD62783AFG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.276", 7.00mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62783AFG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 18-SOIC (0.276", 7.00mm Width) | 7.824 In Stock | $1.69 | ACTIVE | RFQ |
| TBD62783AFNG | Power Distribution Switches | The TBD62783AFNG is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62783AFNG is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 18-LSSOP (0.173", 4.40mm Width) | 35.541 In Stock | $1.41 | ACTIVE | RFQ |
| TBD62783AFWG,EL | Power Distribution Switches | The TBD62783AFWG,EL is a power distribution IC manufactured by Toshiba Semiconductor and Storage. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the TBD62783AFWG,EL is currently in active production through Toshiba Semiconductor and Storage's standard distribution channels. | 18-SOIC (0.295", 7.50mm Width) | 58.444 In Stock | $1.58 | ACTIVE | RFQ |